A dielectric composition includes dielectric particles and first segregations. The dielectric particles each include a perovskite compound represented by ABO.sub.3 as a main component. The first segregations each include at least Ba, V, and O. A molar ratio (Ba/Ti) of Ba to Ti detected in the first segregations is 1.20 or more.

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A solder layer is provided between the electronic element and the interposer board, joins the electronic element with the interposer board, and includes a solder unfilled region.

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The pair of board end surfaces include a metal layer including a Cu-containing layer and a Cu plated layer on an outer periphery of the Cu-containing layer.

An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T0, a relationship of TN<T0 is satisfied. When dimensions of the external nickel layer and the multilayer body are WN and W0, a relationship of WN<W0 is satisfied. The internal nickel electrode layers include at least one uncovered region. The internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region. At least one diffusion region is provided in which copper of the external copper electrode layers is diffused.

In a multilayer ceramic capacitor, an intersection of an interface is defined by a second dielectric ceramic layer, a first internal electrode layer or a second internal electrode layer, and a third dielectric ceramic layer, on a plane including a length direction and a width direction, the second dielectric ceramic layer and the third dielectric ceramic layer include a near intersection region at or near the intersection, and an average particle size of dielectric particles in the near intersection region is smaller than average particle sizes of dielectric particles in the first dielectric ceramic layer, the second dielectric ceramic layer, and the third dielectric ceramic layer.

A conductive paste includes a core including a first metal and a shell including a second metal having a melting point higher than that of the first metal and enclosing a surface of the core. A multilayer ceramic component includes an external electrode having a sintered electrode layer made of the conductive paste.

A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

A multilayer ceramic capacitor includes a ceramic main including first internal electrodes each drawn out to and reaching a pair of end surfaces and second internal electrodes each drawn out to and reaching a pair of side surfaces. A pair of end-surface external electrodes are respectively provided on the pair of end surfaces to be connected to the first internal electrodes, and a pair of side-surface external electrodes are respectively provided on the pair of side surfaces to be connected to the second internal electrodes. Each of the second internal electrodes has drawn-out parts that extend from an electrode main part and reach the pair of side surfaces, and with respect to each of the pair of side surfaces, two or more of the drawn-out parts are provided to extend from the electrode main part and reach the side surface.