A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.

A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, in which the dielectric layers include a plurality of dielectric crystal grains, an average number of dielectric crystal grains per unit thickness (1 μm) of the dielectric layers is 6 or more, and td is 2.0 μm or less, td being an average thickness of at least one of the dielectric layers.

A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO.sub.3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.

A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.

A multilayer ceramic capacitor may include a monolithic body and interleaved first and second pluralities of electrodes extending from the first and second ends, respectively, of the monolithic body towards opposite ends of the monolithic body. A first margin distance and a second margin distance may be formed, respectively, between the electrodes and the opposite ends of the monolithic body. First and second external terminations may be respectively disposed along the first end and second end of the monolithic body and respectively connected with the first and second plurality of electrodes. A margin ratio between a length of the monolithic body and the first margin distance and/or second margin distance may be less than about 10. At least one of the first external termination or the second external termination may include a conductive polymeric composition.

A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld≤Lm.