The present disclosure discloses a sputter coating device and method for a solar cell. The sputter coating device includes a target for sputtering to a substrate, a blocking unit between the target and the substrate, and the orthographic projection of the blocking unit on the substrate partially coincides with the orthographic projection of the target on the substrate.

An apparatus has a cathode target with a cathode target outer perimeter. An inner magnet array with an inner magnet array inner perimeter is within the cathode target outer perimeter. The inner magnet array includes an inner magnet array base portion and an inner magnet array upper portion. A keeper plate assembly is connected to the inner magnet array upper portion and isolates the inner magnet array upper portion from the inner magnet array base portion. An outer magnet array is connected to a bottom surface of the keeper plate. The outer magnet array has an outer magnet array outer perimeter larger than the inner magnet array inner perimeter. The inner magnet array upper portion has a first magnetic orientation and the outer magnet array and the inner magnet array base portion have a second magnetic orientation opposite the first magnetic orientation.

There is provided a substrate processing method of a substrate processing apparatus. The substrate processing apparatus includes at least two targets, magnet-moving mechanisms disposed in one-to-one correspondence with the at least two targets, each of the magnet-moving mechanisms being configured to reciprocate a magnet in a first direction on a back surface of each target, and a substrate moving mechanism configured to move a substrate in a second direction orthogonal to the first direction. The method includes causing the magnet-moving mechanisms to reciprocate the magnets at different phases with each other.

The present invention provides a device for sputtering a material onto a substrate having a surface. The device comprises a chamber that has a target window where sputtering of the surface of the substrate takes place, via a force produced by a pair of magnets. The magnets are moved across the surface of the substrate via a motor of the device. Furthermore, a method of using such a device for sputtering is also contemplated.

A process for manufacturing a transparent body for use in a touch screen panel is provided. The process includes: depositing a first transparent layer stack over a transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index, providing a structured transparent conductive film in a manner such that the first transparent layer stack and the transparent conductive film are disposed over the substrate in this order, and wherein the structured transparent conductive film has a sheet resistance of 100 Ohm/square or below, and depositing a second transparent layer stack over the transparent conductive film, wherein said second transparent layer stack includes at least a third dielectric film with a third refractive index, and a fourth dielectric film or a transparent adhesive with a fourth refractive index, wherein the first transparent layer stack, the structured transparent conductive film and the second transparent layer stack are provided in this order.

A process chamber includes a chamber body having a chamber lid assembly disposed thereon, one or more monitoring devices coupled to the chamber lid assembly, and one or more antennas disposed adjacent to the chamber lid assembly that are in communication with the one or more monitoring devices.

A plasma processing apparatus includes a first electrode, a second electrode disposed to face the first electrode, a chamber, a first high-frequency power supply, a direct-current power supply, and a gas supply source. The plasma processing apparatus generates first plasma to form a film of a reaction product on the second electrode by causing the first high-frequency power supply to supply first high-frequency power to the second electrode and causing the gas supply source to supply a first gas into the chamber; and generates second plasma to sputter the film of the reaction product by causing the first high-frequency power supply to supply the first high-frequency power to the second electrode, causing the direct-current power supply to supply direct-current power to the second electrode, and causing the gas supply source to supply a second gas into the chamber.

The invention relates to a sputtering target, a coating system, and a coating method for same. The sputtering target comprises a base plate with a target plate which is secured thereon and which is made of a first sputtering material with a surface and a plurality of recesses formed therein. A plurality of inserts are arranged in the recesses. At least some of the inserts are made of a second sputtering material, wherein the second sputtering material has a higher sputter yield than the first sputtering material. The aim of the invention is to achieve especially uniform coatings. This is achieved in that the inserts made of the second sputtering material are shaped such that the extent D1, D2 of the inserts, measured in a measuring direction parallel to the surface, increases from the surface to the base plate in a depth direction T.

An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.

Described are methods of fabricating lithium sputter targets, lithium sputter targets, associated handling apparatus, and sputter methods including lithium targets. Various embodiments address adhesion of the lithium metal target to a support structure, avoiding and/or removing passivating coatings formed on the lithium target, uniformity of the lithium target as well as efficient cooling of lithium during sputtering. Target configurations used to compensate for non-uniformities in sputter plasma are described. Modular format lithium tiles and methods of fabrication are described. Rotary lithium sputter targets are also described.