The invention relates to method of milling and imaging a sample. The method comprises the step of providing an imaging system, as well as a milling beam source. The method comprises the steps of milling, using a milling beam from said milling beam source, a sample to remove a layer of the sample; and imaging, using said imaging system, an exposed surface of the sample. As defined herein, the method further comprises the step of determining a relative position of said sample, and using said determined relative position of said sample in said milling step for positioning said sample relative to said milling beam. The relative position of said sample can be a working distance with respect to the imaging system, which can be determined by means of an autofocus procedure.

An analysis device of an embodiment is an analysis device of an active material layer of an electrode of a secondary battery, and includes a processor configured to execute a program to acquire image data that represents active materials in the active material layer processed by ion milling and voids or fillings between the active materials by a difference in brightness, and compare patterns of the difference in brightness between the image data in at least two different states of the active material layer.

A dual-beam device, such as, a scanning electron microscope combined with a focused-ion beam milling column, is employed for a slice-in-image process. Based on one or more images of at least one cross-section of a test volume of a wafer, a wafer tilt is determined.

The invention relates to a workstation (1), a preparation station (2) and a method for manipulating an electron microscopy grid assembly (3). The workstation (1) comprises a first compartment (101), a first gas inlet (102) for generating an overpressure in the first compartment (101), a first glove (104) and a second glove (105), each being fixed in a respective opening (106, 107) of the workstation (1), wherein the first glove (104) and the second glove (105) are movable in the first compartment (101) to manipulate objects in the first compartment (101), wherein the workstation (1) comprises a port (109) for providing a transfer device (4) for an electron microscopy grid assembly (3) in the first compartment (101). The preparation station (2) comprises a coolant reservoir (201, 202), a first part (210) configured to hold a shuttle (6) for holding an electron microscopy grid assembly (3) in a fixed orientation, wherein the preparation station (2) is configured such that the first part (210) is submergable in the cryogenic coolant when the coolant reservoir (201, 202) contains the cryogenic coolant.

A performance of a sample holder 1 used in a charged particle beam device is improved. A shield plate 2 is connected to a sample stand 7. A sample stand 7 is provided with a pressing member 5 that can move in a direction perpendicular to the shield plate 2 in a state in which the pressing member is attached to the sample stand 7, and has a bar shape. A sample supporting member 4 connected to the pressing member 5 is provided at a position facing the shield plate 2. A spring 6 is provided along an outer circumference of the pressing member 5 and is connected to the sample supporting member 4 and the sample stand 7.

The disclosure relates to a method of preparing a sample in a charged particle microscope. The method comprises the steps of providing a sample carrier having a mechanical support contour and a grid member connected thereto. The method comprises the step of connecting said sample carrier to a mechanical stage device of the charged particle microscope. Additionally, the method comprises the step of providing a sample, for example a chunk-shaped or lamella-shaped sample and connecting said sample to the grid member of the sample carrier. The method allows, in an embodiment, easy and reliable transfer of a sample between a bulk sample and a sample carrier.

Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.

The present invention relates to a method for measuring a sample with a microscope, the method comprising scanning the sample using a focusing plane having a first angle with respect to a top surface of the sample and computing a confidence distance based on the first angle. The method further comprises selecting at least one among a plurality of alignment markers on the sample for performing a lateral alignment of the scanning step and/or for performing a lateral alignment of an output of the scanning step. In particular, the at least one alignment marker selected at the selecting step is chosen among the alignment markers placed within the confidence distance from an intersection of the focusing plane with the top surface.

The system described herein relates to a method for operating a beam apparatus, such as a particle beam apparatus or laser beam apparatus, a computer program product and a beam apparatus for carrying out the method, and to an object holder for an object that, for example, is able to be arranged in a particle beam apparatus. The method includes generating a marking on an object holder using a laser beam of a laser beam device and/or using a particle beam of the particle beam apparatus, where the particle beam includes charged particles, arranging an object on the object holder, moving the object holder, positioning the particle beam and/or the laser beam in relative fashion in relation to the object using the marking, and processing, imaging and/or analyzing the object using the particle beam and/or the laser beam.

Methods and apparatus are disclosed for integration of image-based metrology into a milling workflow. A first ion beam milling operation is performed to an edge at a distance from a final target position on a sample. An SEM image of the sample is used to determine a distance between the milled edge and a reference structure on the sample. Based on the determined distance, the ion beam is adjusted to perform a second milling operation to shift the milled edge to the final target position. Extensions to iterative procedures are disclosed. Various geometric configurations and corrections are disclosed. Manufacturing and analytic applications are disclosed in a variety of fields, including read-write head manufacture and TEM sample preparation. Other combinations of imaging and milling tools can be used.