A pressure control device 20 includes a pressure control valve 25, a flow resistance 23 provided downstream of the pressure control valve, for restricting a gas flow, a first pressure sensor 21 for measuring a gas pressure between the pressure control valve and the flow resistance, a second pressure sensor 22 for measuring a gas pressure downstream of the flow resistance, and an arithmetic control circuit 26 connected to the first pressure sensor and the second pressure sensor. The pressure control device is configured to control the gas pressure downstream of the flow resistance by adjusting an opening degree of the pressure control valve based on an output of the second pressure sensor regardless of an output of the first pressure sensor control, and calculate the flow rate of the gas downstream of the flow resistance based on the output of the first pressure sensor and the output of the second pressure sensor.

A substrate processing device includes a processing tank, a substrate holding unit, a fluid supply unit, and a control unit. The processing tank stores a processing liquid for processing a substrate. The substrate holding unit holds the substrate in the processing liquid in the processing tank. The fluid supply unit supplies a fluid to the processing tank. The control unit controls the fluid supply unit. The control unit controls the fluid supply unit such that the fluid supply unit changes supply of the fluid during a period from a start of supply of the fluid to the processing tank storing the processing liquid in which the substrate is immersed to an end of supply of the fluid to the processing tank storing the processing liquid in which the substrate is immersed.

Disclosed is an apparatus for transferring a substrate. The apparatus includes a transfer robot, a linear rail unit including a movable plate on which the transfer robot is mounted and a running shaft on which the movable plate travels, and a particle diffusion prevention member that prevents diffusion of particles to the outside by maintaining a differential pressure between the movable plate and the running shaft.

An apparatus 1 for processing a plurality of substrates 3 is provided. The apparatus may have a process tube 5 creating a process chamber 7; a heater 9 surrounding the process tube 5; a flange 11 for supporting the process tube; and a door 15 configured to support a wafer boat 17 with a plurality of substrates 3 in the process chamber and to seal the process chamber 7. An exhaust operably connected to the process chamber 7 may be provided to remove gas from the process chamber via a first exhaust duct 19. The apparatus may be provided with an extractor chamber 21 surrounding the first exhaust duct where it connects to the process chamber and connected to a second exhaust duct 23 to remove gas from the extractor chamber.

A solution dispense system for a semiconductor manufacturing process includes a longer circulation loop in order to minimize the idle section from resist pump to dispense nozzle. A t-valve and control valve are disposed close to the nozzle in order to decrease the idle section and reduce material consumption.

Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow require a variety of fluid flow components which are tightly packaged within the apparatuses for controlling flow. Servicing the apparatuses requires specialized equipment and methods which enable installation of seals in close quarters in apparatuses which are installed in the field. Seal retainers may be used to retain the seals during assembly of fluid flow components into apparatus for controlling flow.

The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a first pressure adjusting unit which injects a gas into the etchant pump to apply an operation pressure, a second pressure adjusting unit which pressurizes the etching chamber and the etchant supply part at the same predetermined pressure, a back pressure adjusting unit which adjusts a pressure of the gas discharged when the etchant pump operates, and a valve which controls an order and a direction in which the gas is injected into or discharged from the etchant pump.

The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a gas circulation pipe connected from a predetermined point of an upper portion of the etchant supply part to a predetermined point of an upper portion of the etching chamber and formed to circulate a gas, and an air pump formed at one side of the gas circulation pipe and configured to forcibly circulate the gas.

Described herein is a technique capable of properly attaching a nozzle to a reaction tube. According to one aspect thereof, there is provided a nozzle installation jig including: a lower plate configured to make contact with a process vessel in a vicinity of a lower end opening of the process vessel in which a nozzle is provided; a frame fixed to the lower plate and extending upward with respect to the lower plate; an upper plate fixed to the frame and provided with a sensor configured to detect a position of the nozzle in the process vessel; and a notification device configured to transmit a notification to an operator according to a detection result of the sensor.

A substrate processing apparatus includes a nozzle unit including a nozzle tip discharging liquid to a substrate; and a liquid supply line supplying the liquid to the nozzle unit, wherein the liquid supply line includes a liquid supply pipe connected to the nozzle tip; a supply valve installed in the liquid supply pipe; and a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe.