There is an apparatus for transferring a thin-film element, the apparatus comprising: a belt-type stamp; at least one support roller configured to allow a movement of the stamp; a first-stage roller system including at least one first-stage roller, wherein the first-stage roller is configured to allow thin-film elements attached to a first substrate to be picked up from the first substrate and to be attached to the stamp, wherein; and a second-stage roller configured to allow the thin-film elements attached to the stamp to be picked up from the stamp and to be printed onto a second substrate, wherein a curvature radius of the first-stage roller and a curvature radius of the second-stage roller are different from each other.

The present invention relates to a system having a transfer head for transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a system having a transfer head for transferring a micro LED, the system being configured such that the transfer head does not use an electrostatic force and preventing the generation of an electrostatic force which may cause a problem. In addition, the present invention relates to a system having a transfer head for transferring a micro LED, the system employing a suction structure using a suction force to transfer a micro LED by a porous member, thereby solving problems of the related art.

A method of semiconductor packaging includes providing a plurality of substrate units including at least one good known substrate unit on a first adhesive layer of a first carrier. The method includes applying a first activating source to the first adhesive layer in situ such that the first adhesive layer releases from the at least one good known substrate unit without physical contact by an outside source to the at least one good known substrate unit. The method includes transferring the at least one good known substrate unit onto a second adhesive layer of a second carrier, attaching at least one die to the at least one good known substrate unit, and applying a second activating source to the second adhesive layer such that the second adhesive layer releases from the at least one good known substrate unit.

A roll micro-transfer printer comprises a source substrate having sacrificial portions spaced apart by anchors and micro-devices each disposed exclusively in association with a sacrificial portion and physically connected to at least one of the anchors by a tether. A roll stamp comprising a visco-elastic material disposed in alignment with the source substrate contacts micro-devices on the source substrate to fracture or separate the tether and adhere the micro-devices to the roll stamp. A destination substrate disposed in alignment with the roll stamp contacts micro-devices on the roll stamp and adheres the micro-devices to the destination substrate. The roll stamp is disposed to rotate about a roll stamp axis, the source substrate transport is disposed to translate in a source substrate direction orthogonal to the roll stamp axis, and the destination substrate transport is disposed to translate in a destination substrate direction opposite to the source substrate direction.

A system for fan out chip encapsulation processing is provided, wherein a plurality of microchips are encapsulated in molding compound, the system comprising: an atmospheric loading camber, configured to load substrates onto carriers in atmospheric environment; an entry loadlock arrangement configured to introduce the carriers into vacuum environment of the system; a degas chamber positioned downstream of the loadlock arrangement within the vacuum environment, the degas chamber comprising a heating element and a pumping arrangement to remove gases emitted from the molding compound; an etch chamber positioned downstream of the degas chamber and within the vacuum environment, the etch chamber comprising an ion beam generator and an ion neutralizer; a metal sputtering chamber positioned downstream of the etch chamber and inside the vacuum environment; and, an exit loadlock arrangement configured to remove carriers from the vacuum environment.

An injection device includes: an injection nozzle injecting an injection agent into a target container, and a vibration generating device vibrating the injection nozzle in a plurality of directions during injection of the injection agent.

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected through a first joining material to the conductive pattern, a second semiconductor chip with a rectangular shape disposed on the conductive pattern separated from the first semiconductor chip and connected through a second joining material to the conductive pattern, a terminal disposed above the semiconductor chips, respectively connected to the first and second semiconductor chips through third and fourth joining materials, the terminal having a through-hole above a place between the first and second semiconductor chips, the method including a positioning step in which the first and second semiconductor chips are respectively positioned at at least three positioning places, and at least one of the positioning places is positioned with a positioning member inserted into the through-hole.

A delivery roll (1) for thermal interface components, the roll comprising a carrier tape (10), an adhesive layer (10a), and a plurality of thermal interface components (20), wherein the adhesive layer (10a) is arranged on a surface of the carrier tape (10); each thermal interface component (20) comprises a top liner (22), a bottom liner (26) and a thermal interface pad (24) arranged therebetween; the carrier tape (10) supports the plurality of thermal interface components (20) by the adhesive adhering to the bottom liner (26) of each thermal interface component (20); and the plurality of thermal interface components (20) is arranged in a spaced apart manner along the carrier tape (10). The invention also relates to a manufacturing method for a delivery roll.

An embodiment method includes providing a fan-out package structure having cavities to confine semiconductor dies by applying adhesive material which has similar coefficient of thermal expansion (CTE) with semiconductor dies in the gap between the edges of dies and the edges of cavities. The method further includes forming a molding compound over a fan-out package structure with semiconductor dies, building fan-out redistribution layers over a fan-out package structure with semiconductor dies and electrically connected to the semiconductor dies.