Disclosed is a manufacturing apparatus of a light-emitting element. The manufacturing apparatus includes: a main transporting route including a first transfer device and a second transfer device connected to each other through a first transporting chamber; a sub-transporting route extending in a direction intersecting the main transporting route, the sub-transporting route including: a second transporting chamber connected to the first transfer device or the second transfer device; and a delivery chamber connected to the second transporting chamber; and a plurality of treatment chambers connected to the delivery chamber. A region to which the first transfer device, the second transfer device, the first transporting chamber, and the second transporting chamber are connected is under a continuous vacuum environment.

A method for mass arrangement of micro-component devices includes the following process stages: disposing the micro-component devices to float on a liquid suspending medium, wherein the micro-component devices are spaced apart from each other with a larger initial gap along a first direction and along a second direction; using electromagnetic force to actuate the floating micro-component devices to move closer so that the micro-component devices become spaced apart from each other with a smaller specified target gap along the first and the second directions; and transferring the arranged micro-component devices with the target gap on a carrier substrate. A system for arranging the micro-component devices is also disclosed to implement the method. Therefore, a precisely arranged array of the micro-component devices can be formed on a target application substrate.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

A forming apparatus forming a composition on a substrate by using a mold, includes a supplier configured to supply a composition on the substrate, a plurality of processors including a first processor and a second processor, each of the plurality of processors being configured to bring the mold into contact with the composition supplied onto the substrate by the supplier, and a substrate conveyer configured to convey the substrate onto which the composition is supplied by the supplier to the first processor and then convey other substrate onto which the composition is supplied following the substrate to the second processor.

A method includes determining an alignment error between a discrete component of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including the discrete component adhered to a support by a dynamic release layer; based on the alignment error, determining a beam offset characteristic; and providing a signal indicative of the beam offset characteristic to an optical element of the laser-assisted transfer system, the optical element being configured to adjust a position of a beam pattern relative to the discrete component according to the beam offset characteristic.

Packaged modules can be manufactured by providing or forming a substrate panel having first and second sides, and an array of units, and mounting one or more devices on the first side of the substrate panel for each unit. A first mold layer can be formed over the first side of the substrate panel to provide an assembly, with the first mold layer having an initial thickness that is greater than a final thickness, such that the initial thickness is sufficiently large to prevent warpage of the assembly where a similar assembly having a first mold layer with the final thickness would warp. One or more process operations can be performed on the second side of the substrate panel of the assembly, and a thinning operation can reduce the thickness of the first mold layer from the initial thickness to the final thickness.

Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.

A stack boat tool includes a boat including a stack hole configured to accommodate first and second semiconductor packages; and a weight bar configured to be placed on the second semiconductor package during a reflow process for combining the first and second semiconductor packages, wherein the weight bar includes: a base configured to contact an upper surface of the second semiconductor package; a sidewall on the base; and a balance weight arranged on the base configured to lower a weight center of the weight bar.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements

A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.