A substrate lifting device, a substrate packaging apparatus and a substrate packaging method are provided. The substrate lifting device is for lifting a first substrate when the first substrate is aligned to a second substrate, and includes a rotatable mechanism, a rotatable rod, a nozzle and a gas providing mechanism. The rotatable rod is rotatable about the rotatable mechanism. The nozzle is on the rotatable rod. The gas providing mechanism ejects a gas from the nozzle to lift the first substrate.

Embodiments of the invention relate generally to directed self-assembly (DSA) and, more particularly, to the DSA of electronic components using diamagnetic levitation.

There is provided a processing method for a package substrate having a plurality of division lines formed on the front side. The processing method includes the steps of holding the back side of the package substrate by using a holding tape and fully cutting the package substrate along the division lines to such a depth corresponding to the middle of the thickness of the holding tape by using a profile grinding tool, thereby dividing the package substrate into individual semiconductor packages. The profile grinding tool has a plurality of projections for cutting the package substrate respectively along the plural division lines. Each projection has an inclined side surface.

A die bonding system and a die bonding method are disclosed, in which dies (10) fed from a first motion stage (100) serving as a die source are re-arranged on a transfer tray (20) carried on a second motion stage (200) and bonded to a substrate (30) carried on a third motion stage (300). Pickup and transfer of the dies (10) between the three motion stages are accomplished by two motion mechanisms (010, 020) in such a manner that the dies (10) picked up from the first motion stage (100) are placed on the second motion stage (200) in an arrangement based upon a required final arrangement of them on the substrate (30). In other words, the dies (10) are re-arranged according to the required arrangement on the substrate (30). In this way, the need for re-arranging the dies after the transfer tray (20) is flipped and before they are bonded to the substrate is eliminated. Therefore, with the die bonding system, multiple dies 10 are allowed to be transferred simultaneously to the substrate based on the process requirements by flipping the mechanism for flipping the dies only once, which results in enhanced production efficiency and time savings and addresses the requirements for mass production.

A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

The disclosure provides a micro light-emitting diode mass transfer apparatus and method. The micro light-emitting diode mass transfer apparatus includes a solution container, display backplanes, a solution drive assembly and a liquid level control assembly. The solution container contains a transfer solution, and micro light-emitting diodes to be transferred float on the liquid surface of the transfer solution. The display backplanes are submerged in the transfer solution and each provided with a plurality of chip mounting cells; mounting cell opening directions of the plurality of chip mounting cells face toward the micro light-emitting diodes; and at least one of the chip mounting cells is exposed on the liquid surface. The solution drive assembly is disposed in the solution container. The liquid level control assembly is configured to control a liquid level of the transfer solution in the solution container. The liquid level control assembly controls the liquid level of the transfer solution, the solution drive assembly provides a centrifugal force to the transfer solution, and the micro light-emitting diodes are precisely transferred into the corresponding chip mounting cells through the centrifugal force.

A working system for a semiconductor packaging process includes a machine equipment and a supply unit correspondingly connected to the machine equipment, and the supply unit includes an input device, an output device and a pick-and-place device for inputting a magazine to the input device and/or outputting the magazine from the output device, so that the magazine is automatically transported to the input device or away from the output device by the pick-and-place device, thereby accelerating the operation speed of the production line.

Mass transfer equipment including a base stage, a first substrate stage, a second substrate stage, at least one laser head and a servo motor module is provided. The first substrate stage is adapted to drive a target substrate to move along a first direction. The second substrate stage is adapted to drive at least one micro device substrate to move along a second direction. The at least one laser head is adapted to move to a target position of the second substrate stage and emits a laser beam toward the at least one micro device substrate. At least one micro device is separated from a substrate of the at least one micro device substrate and connected with the target substrate after the irradiation of the laser beam. The servo motor module is used for driving the first substrate stage, the second substrate stage and the at least one laser head to move.

The present invention provides a chip mounting system and a method for mounting chips. The chip mounting system includes a first carrier device, a second carrier device, and a chip capturing device. The first carrier device includes a plurality of first carrier platforms for respectively carrying a plurality of semiconductor structures. Each semiconductor structure includes a base layer and a plurality of light emitting chips disposed on the base layer. The second carrier device includes a second carrier platform for carrying a circuit substrate. The chip capturing device is used for moving the light emitting chip from the base layer to the circuit substrate. The red, the green, and the blue light-emitting groups of the same sequence are disposed adjacent to each other, so that the red, the green, and the blue light-emitting chips of the same sequence are arranged adjacent to each other to form a pixel.

A substrate lifting device, a substrate packaging apparatus and a substrate packaging method are provided. The substrate lifting device is for lifting a first substrate when the first substrate is aligned to a second substrate, and includes a rotatable mechanism, a rotatable rod, a nozzle and a gas providing mechanism. The rotatable rod is rotatable about the rotatable mechanism. The nozzle is on the rotatable rod. The gas providing mechanism ejects a gas from the nozzle to lift the first substrate.