Disclosed is a liquid processing apparatus including: a plurality of substrate placement regions; a nozzle that supplies a processing liquid to a substrate from each processing position; a nozzle placement region provided behind a row of the substrate placement regions; an arm that detachably holds the nozzle at one end side; a driving unit that horizontally pivots the arm around a pivot axis; and a controller that outputs a control signal to convey the nozzle from the nozzle placement region to a standby position corresponding to a processing position of a conveyance destination, cause the nozzle to stand by at the standby position, and then, convey the nozzle to the processing position. The standby position is outside the substrate placement regions and is located between the processing position and the nozzle placement region when viewed in a front-and-rear direction.

Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

An apparatus includes a first substrate chuck configured to hold a first substrate, a second substrate chuck configured to hold a second substrate, and a dispenser configured to dispense a formable material onto the first substrate while the first substrate overlies the first substrate chuck and to dispensing the formable material onto the second substrate while the second substrate overlies the second substrate chuck. A method of forming a planarization layer on a substrate can use the apparatus. A method of making an article can include the method of forming the planarization layer.

An improved fluid delivery system and method that directly controls the concentration of constituent components in a fluid mixture delivered, for example, to a process chamber. Pressure of the fluid mixture can also be directly controlled. A concentration sensor capable of measuring concentration of all of the constituent components in a fluid mixture is used to provide signals used to vary the flow rate of constituent gases under a closed loop feedback system. The signal output of one or more pressure sensors can also be used to provide a signal used to vary the flow rate of constituent gases under a closed loop feedback system. By directly controlling these two extremely important process variables, embodiments of the present invention provide a significant advantage in measurement accuracy over the prior art, enable real-time process control, reduce system level response time, and allow for a system with a significant footprint reduction.

A photoresist layer is coated over a wafer. The photoresist layer includes a metal-containing material. An extreme ultraviolet (EUV) lithography process is performed to the photoresist layer to form a patterned photoresist. The wafer is cleaned with a cleaning fluid to remove the metal-containing material. The cleaning fluid includes a solvent having Hansen solubility parameters of delta D in a range between 13 and 25, delta P in a range between 3 and 25, and delta H in a range between 4 and 30. The solvent contains an acid with an acid dissociation constant less than 4 or a base with an acid dissociation constant greater than 9.

A substrate liquid processing apparatus includes a liquid processing unit that processes a substrate with processing liquids, an exhaust pipe, individual exhaust pipes corresponding to at least one of the processing liquids and an exhaust switching unit. Further, the exhaust switching unit comprises an exhaust gas inlet chamber and switching mechanisms. The switching mechanisms correspond to the individual exhaust pipes, respectively, and each of the switching mechanisms includes an exhaust gas suction opening communicating with the exhaust gas inlet chamber; an outlet opening communicating with a corresponding one of the individual exhaust pipes; an exterior air suction opening; and a valve body that switches a communication state of the exhaust gas suction opening, the outlet opening and the exterior air suction opening between a state where the exhaust gas suction opening communicates with the outlet opening and a state where the exterior air suction opening communicates therewith.

According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.

The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.

A pattern forming apparatus which forms a pattern on a substrate, which includes a movable stage, a holding unit removably attached to the stage and configured to suck and hold the substrate, an optical system of which position with respect to the holding unit is fixed, and configured to detect an alignment mark of the substrate which is sucked by the holding unit from a suction surface side of the substrate, a reference mark for measuring a position of a detection field of the optical system, and a detection system configured to detect the reference mark. The substrate is disposed on the holding unit in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from the suction surface side of the substrate by the optical system is disposed in the detection field of the optical system.

A substrate processing apparatus includes: a substrate holder configured to hold a substrate; a processing liquid supply part configured to supply a processing liquid to the substrate held by the substrate holder; a chemical liquid supply part configured to supply a chemical liquid as a component of the processing liquid to the processing liquid supply part; a pure water supply part configured to supply pure water as a component of the processing liquid to the processing liquid supply part; a low-dielectric constant solvent supply part configured to supply a low-dielectric constant solvent as a component of the processing liquid to the processing liquid supply part; and a controller configured to control a ratio of the chemical liquid, the pure water, and the low-dielectric constant solvent contained in the processing liquid by controlling the chemical liquid supply part, the pure water supply part, the low-dielectric constant solvent supply part.