The present disclosure relates to a semiconductor device, including: at least two processing units; a processing liquid spraying arm, which is located above the processing units; a fixed baffle, located between the adjacent processing units, the fixed baffle being provided with an opening by which the adjacent processing units are communicated, the processing liquid spraying arm moving between the adjacent processing units through the opening; a movable baffle, located at least on one side of the fixed baffle or located in the fixed baffle; a first driving apparatus, connected to the movable baffle and configured to drive the movable baffle to move to completely block the opening when the processing liquid spraying arm stops in the processing unit, so as to isolate the adjacent processing units, and drive the movable baffle to move to unblock the opening when the processing liquid spraying arm moves between the adjacent processing units.

A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

There is provided a manufacturing method of a protective-component-provided workpiece. The manufacturing method of a protective-component-provided workpiece includes a step of dissolving a thermoplastic resin whose solubility parameter is equal to or higher than 8.5, in a liquid ultraviolet-curable resin, to prepare a liquid mixed resin, a step of supplying the mixed resin to a support surface of a support table to form a resin layer with a predetermined thickness, a step of irradiating the resin layer with ultraviolet rays and curing the resin layer to form a protective component with a sheet shape, and a step of heating the sheet-shaped protective component before or after one surface of the sheet-shaped protective component and one surface of the workpiece are brought into close contact with each other, and causing the sheet-shaped protective component to come into close contact with the workpiece and integrate with the workpiece.

A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.

The present invention relates to a temperature control device for a chemical liquid used in a semiconductor manufacturing process, which is located on a chemical liquid circulating and supplying tube to control a temperature of the chemical liquid. The device includes: a first heat sink having a cooling water flow path formed therein; a plurality of thermoelectric modules coming into contact with both side surfaces of the first heat sink, respectively; and a second heat sink coming into contact with the thermoelectric modules, while placing the first heat sink between the thermoelectric modules, and having a plurality of chemical liquid flow path tubes adapted to flow the chemical liquid therealong.

An imprint method includes contact step of bringing imprint material on shot region of substrate and pattern region of mold into contact with each other, alignment step of aligning the shot region and the pattern region after the contact step, first irradiation step of, before the alignment step is completed, irradiating frame-shaped portion of the imprint material with light, second irradiation step, started after the first irradiation step is started, irradiating at least part of the imprint material on the shot region with light under condition different from condition in the first irradiation step so that alignment error between the shot region and the pattern region is reduced, third irradiation step of irradiating the entire imprint material on the shot region with light after the alignment step is completed.

A method for manufacturing a semiconductor device includes obtaining a first image of a fluid dispense nozzle using a first camera, the fluid dispense nozzle configured to dispense fluid on a semiconductor substrate, obtaining a second image of the fluid dispense nozzle using a second camera, the second image having a higher resolution than the first image, determining a width of the fluid dispense nozzle at multiple intervals along the fluid dispense nozzle and a width of a spray pattern of a fluid being dispensed from the fluid dispense nozzle at multiple intervals along the spray pattern, fitting a first straight line to a series of data points representing a plurality of widths of the intervals along the fluid dispense nozzle and a plurality of widths of the intervals along the spray pattern, determining a first slope of the first straight line, and determining a condition of the spray pattern and the fluid dispense nozzle based on the first slope.

A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.

A coating device includes: a coating liquid holding part that is provided with an upper opening portion and a lower opening portion and holds a coating liquid, and in which a cylindrical body penetrates the upper opening portion and the lower opening portion, and the cylindrical body is relatively moved to an upper side in an up-down direction, so that the coating liquid is applied to an outer peripheral surface of the cylindrical body; a container that accommodates the coating liquid that flows down; a circulation part that circulates the coating liquid in the container to the coating liquid holding part; and a receiving member that is disposed above a liquid level of the coating liquid in the container and receives the coating liquid flowing downward along the outer peripheral surface of the cylindrical body with an inclined surface.

A temperature control system includes a circulation channel including a temperature control target to be temperature-controlled via a fluid, a heater capable of heating the fluid, and a cooler capable of cooling the fluid, a bypass channel connected to each of a first portion of the circulation channel located upstream of the cooler and a second portion of the circulation channel located downstream of the cooler to bypass the cooler, a valve device capable of controlling a flow rate of the fluid flowing through the cooler and a flow rate of the fluid flowing through the bypass channel individually, and a control device. The control device includes a valve controller configured to control the valve device to make a temperature of the fluid at the second portion equal to a predetermined temperature.