A dividing apparatus includes a table having a transparent plate having a holding surface for holding a workpiece thereon and a lower illumination unit for illuminating the holding surface from below, a first storage section for storing a first image including a white portion where illumination light from the lower illumination unit is transmitted through the workpiece and displayed as white and a black portion where the illumination light is blocked by the workpiece and displayed as black when an image of a kerf defined by a dividing unit in the workpiece held on the holding surface is captured by an image capturing unit with the lower illumination unit being energized, and a white pixel detecting section for detecting whether or not there are pixels in the white portion of the first image in directions perpendicular to directions along which a street extends.

A semiconductor review tool receives absolute Z-height values for the semiconductor wafer, such as a semiconductor wafer with a beveled edge. The absolute Z-height values can be determined by a semiconductor inspection tool. The semiconductor review tool reviews the semiconductor wafer within a Z-height based on the absolute Z-height values. Focus can be adjusted to within the Z-height.

Described herein is a technique capable of properly attaching a nozzle to a reaction tube. According to one aspect thereof, there is provided a nozzle installation jig including: a lower plate configured to make contact with a process vessel in a vicinity of a lower end opening of the process vessel in which a nozzle is provided; a frame fixed to the lower plate and extending upward with respect to the lower plate; an upper plate fixed to the frame and provided with a sensor configured to detect a position of the nozzle in the process vessel; and a notification device configured to transmit a notification to an operator according to a detection result of the sensor.

A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.

A linear electrical machine comprising a frame with a level reference plane and an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane. The array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to an alternating current power source energizing each electromagnet. At least one reaction platen of paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets with alternating current generates levitation and propulsion forces against the reaction platen that controllably levitate and propel the reaction platen along at least one drive line, in a controlled attitude relative to the drive plane.

A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.

An object of the invention is to realize a high transfer throughput in a wafer transfer apparatus in which a wafer transfer robot transfers a wafer via an aligner. A wafer transfer apparatus includes a wafer transfer robot, and a separation dimension between a pair of wafer holding rods forming a finger of the wafer transfer robot is set to be larger than a dimension of a body portion of an aligner in a width direction provided in the wafer transfer apparatus. In addition, an elevating mechanism provided in the wafer transfer apparatus is configured to be able to move the finger to below the body portion of the aligner, thereby achieving the object of the invention.

A wafer processing apparatus including a supporting unit having a frame fixing section fixing the frame, and a wafer table having a front side and a rear side, the front side including a supporting face supporting the wafer and a transparent plate, a liquid layer forming unit including a nozzle section and forming a layer of a liquid on the supporting face of the wafer table, an imaging unit including an imaging camera positioned adjacent to the rear side of the wafer table and opposite to the supporting face on the front side of the wafer table and an air blowing nozzle blowing air to a region between the wafer table and the adhesive sheet.

A sensor may be used to measure a degree of tilt of a sample. The sensor may include an apparatus having a light source, first, second, and third optical elements, a lens, and an aperture. The first optical element may supply light from the light source toward the sample, and may supply light input into the first optical element from the sample toward the second optical element. The second optical element may supply light toward first and second sensing elements. An aperture may be arranged on a focal plane of the lens. A light beam incident on the first sensing element may be a reference beam.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.