A correction device for wafers and rotational drive mechanism of the wafers and a correction method thereof. The correction device includes a first robotic arm, an image capturing assembly and a wafer locating member installation/uninstallation mechanism disposed on the first robotic arm. The correction device further includes a second robotic arm and a wafer taking/placing mechanism disposed on the second robotic arm. The first robotic arm drives the image capturing assembly and the wafer locating member installation/uninstallation mechanism to move to a main correction mechanism to correct the image capturing range and the operation position thereof. The second robotic arm drives the wafer taking/placing mechanism to move to the main correction mechanism to correct the operation position thereof. The wafer taking/placing mechanism moves the wafer to a wafer correction mechanism to read the data of the wafer and adjust the wafer to a true angular position.

Embodiments of the present disclosure relate to the field of semiconductor manufacturing, and provide a carrier device. The carrier device includes a carrier 11 and a carrying plate 12 rotatably provided on the carrier 11, where in a non-working state, the carrying plate 12 is in an inclined position; in a working state, the carrying plate 12 is in a horizontal position. The present disclosure makes it hard for impurities such as dust to accumulate on the carrier, so as to prevent a photomask from being contaminated and improve the product yield.

An overlay measurement device measures an error between a first overlay mark and a second overlay mark respectively formed on different layers formed on a wafer. The device is configured to detect a height of the first overlay mark based on a change in the signal of the first detector according to a change in the relative position of the objective lens with respect to the wafer in the optical axis direction and detect a height of the second overlay mark based on a change in the signal of the second detector according to a change in the relative position of the objective lens with respect to the wafer in the optical axis direction.

A substrate transfer method for transferring a substrate using a first transfer body and at least one second transfer body comprises transferring the substrate using the first transfer body to a predetermined first substrate reference position in a module, receiving the substrate at the first substrate reference position using the second transfer body, and transferring the substrate to a detection device by moving the second transfer body to a predetermined first transfer body reference position and detecting positional misalignment in plan view between a position of the substrate and a predetermined second substrate reference position in the detection device. Each of the first transfer body and the second transfer body floats from a bottom portion of a substrate transfer area by a magnetic force and moves in a horizontal direction while supporting the substrate.

A thin-film deposition system includes a top plate positioned above a wafer and configured to generate a plasma during a thin-film deposition process. The system includes a gap sensor configured to generate sensor signals indicative of a gap between the wafer and the top plate. The system includes a control system configured to adjust the gap during the thin-film deposition process responsive to the sensor signals.

A method and an apparatus for bonding semiconductor substrates are provided. The method includes at least the following steps. A first position of a first semiconductor substrate on a first support is gauged by a gauging component embedded in the first support and a first sensor facing towards the gauging component. A second semiconductor substrate is transferred to a position above the first semiconductor substrate by a second support. A second position of the second semiconductor substrate is gauged by a second sensor mounted on the second support and located above the first support. The first semiconductor substrate is positioned based on the second position of the second semiconductor substrate. The second semiconductor substrate is bonded to the first semiconductor substrate.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an entrance for taking in and taking out a substrate at a side wall; a support unit provided inside of the chamber and supporting the substrate; an imaging unit for imaging a substrate being taken in by a transfer robot through the entrance; and a controller is configured to control a position of the transfer robot based on an image data from the imaging unit.

An object transfer device includes: a motor; a motor drive circuit; an encoder that detects a motor output shaft rotation angle; a drive system that transmits motion of the output shaft to an object; an origin sensor that detects arrival of a predetermined site of the drive system interlocked with the object at a predetermined position; a drive circuit-including servo amplifier that records a current position of the object based on detection by the encoder and the origin sensor, and controls the object to a target position; an absolute position holder that acquires an absolute position of the predetermined site based on detection by the encoder at least while the drive circuit is off; and a power saving controller that is bidirectionally communicable with the servo amplifier and can resume servo control with the absolute position as a current position of the predetermined site when the drive circuit is on.

A substrate processing apparatus according to the embodiment includes: a substrate holding unit that holds a substrate; a rotation support unit that supports the substrate holding unit and rotates the substrate n a circumferential direction; a drive unit that drives the substrate holding unit with respect to the rotation support unit in a plane direction of the substrate; a detection unit that detects an outer edge portion of the substrate; a chemical liquid discharge unit that discharges a chemical liquid to the outer edge portion of the substrate; and a control unit that causes the drive unit to drive the substrate holding unit based on the outer edge portion detected by the detection unit in a manner that a center position in a plane of the substrate matches a rotation axis of the rotation support unit.

A system and method for generating an angular calibration factor (ACF) for a metrology tool useful in a fabrication process, the method including providing the metrology tool, the metrology tool including a stage and a housing, measuring a rotational orientation of the stage relative to the housing and generating the ACF for the stage based at least partially on the rotational orientation.