H01L21/67259

TRANSPORTATION SYSTEM OF A CASSETTE AND METHOD OF AUTO TEACHING A POSITION OF A CASSETTE
20230064709 · 2023-03-02 · ·

A transportation system of a cassette according to an embodiment of the present invention comprises a port and a system controller. The port accommodates a cassette carrying a glass substrate. The port includes a plurality of displacement sensors for sensing a position of a cassette. The system controller calculates a distortion amount of the cassette using a plurality of sensed values of the cassette and a misplaced amount of the displacement sensors to determine whether the cassette is in a normal settlement status. Therefore, the position of the cassette can be automatically taught without clamping operation of a clamping device clamping the cassette disposed in the port, so that it is possible to prevent defects of the glass substrate by removing various defect-causing factors such as particles and static electricity that may occur during a conventional clamping operation.

TEACHING APPARATUS AND SUBSTRATE ALIGNMENT APPARATUS USING THE SAME

A teaching apparatus includes a chamber; an electrostatic chuck in the chamber, the electrostatic chuck including a sidewall surrounding a loading area; an aligner configured to be loaded onto the loading area of the electrostatic chuck; a vision sensor configured to obtain measurement data by measuring separation distances of separation regions between the aligner and the sidewall of the electrostatic chuck and to transmit the measurement data; a transfer robot configured to load the aligner onto a reference position of the loading area and to position the vision sensor above the electrostatic chuck; and controller configured to reset the reference position and to equalize the separation distances based on the measurement data transmitted from the vision sensor.

SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTING WAFER

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

SUBSTRATE TRANSFER DEVICE AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME
20220328340 · 2022-10-13 ·

The present disclosure relates to a substrate transfer device for sensing deflection of an end-effector and a substrate processing apparatus having the same. The substrate transfer device includes: an end-effector extending in a first direction and supporting a substrate; an end-effector hand connected with one side in the first direction of the end-effector; a horizontal movement unit connected with the end-effector hand and moving the end-effector in the first direction; and a deflection sensing unit including a light emitting part and a light receiving part, which are respectively disposed at both sides of a movement path of the end-effector, and sensing deflection of the end-effector.

SUBSTRATE HOLDING HAND AND SUBSTRATE TRANSFERRING ROBOT

A substrate holding hand includes a supporting plate where a circular reference capture range is defined, a plurality of pads disposed within the reference capture range, at least one stationary stopper that is disposed along an outer circumferential circle of the reference capture range, at least one movable stopper having a part at the same height from the supporting plate as the stationary stopper, and a stopper actuator that moves the movable stopper from a retracted position outside the reference capture range to a deployed position closer to the stationary stopper than the retracted position. A circular reduced capture range is defined by the movable stopper at the deployed position, and the front stopper, and a diameter of the reduced capture range is larger than a diameter of the substrate and smaller than a diameter of the reference capture range.

PROCESSING APPARATUS
20230115824 · 2023-04-13 ·

A processing apparatus includes a holding table having a holding surface that holds a workpiece and is smaller than the workpiece, a processing unit that processes the workpiece held by the holding table, an imaging unit that images the workpiece held by the holding table, and a controller. The holding table has a reflecting unit that surrounds the holding surface and is allowed to be positioned below an edge of the workpiece held by the holding surface, and at least part of the reflecting unit is formed of a reflective component and is imaged by the imaging unit in a state where the edge of the workpiece is positioned above the reflective component.

Spin coating device and method

A spin coating device and method. The spin coating device includes a rotatable rotary shaft and sucker fixed on an end portion of the shaft, and an electromagnetic induction device below the sucker which includes an annular magnet fixed below the sucker, coil group formed by a first and second coil, and strip-shaped magnet fixed at the rotary shaft. A base on the sucker has a notch. The unbalanced centrifugal force during rotation of the sucker causes vibration. The electromagnetic induction device enables the centrifugal force generated during rotation of the sucker to be in balance with the magnetic force generated by the electromagnetic induction device to adjust the levelness of the sucker surface. The device does not need manual manipulation, enables the sucker to be more stable, reduces damage to the equipment due to vibration, and improves the effect of photoresist spin-coating while saving time and labor.

HAND, TRANSFER APPARATUS, AND SUBSTRATE PROCESSING APPARATUS

A hand for holding the substrate includes a hand main body and a plurality of seating members mounted on the hand main body and on which the substrate is to be seated. Each of the plurality of seating member includes a shaft member supported to the hand main body and a lever member that is supported to the shaft member and includes a first end portion including a seating portion on which the substrate is to be seated and a second end portion disposed on a side opposite to the first end portion across the shaft member. At least a part of the plurality of seating members further includes a biasing member for giving a force of rotating the lever member to the lever member such that the second end portion moves downward and a seating sensor configured to detect an upward movement of the second end portion.

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
20230114015 · 2023-04-13 ·

The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.

Wireless substrate-like teaching sensor for semiconductor processing

A wireless substrate-like sensor for teaching transfer coordinates to a robotic substrate handling system is provided. The sensor includes a base portion sized and shaped like a substrate handled by the robotic substrate handling system. An electronics housing is coupled to the base portion. A power module is disposed within the electronics housing and configured to power components of the sensor. At least one edge camera is disposed near an edge of the base portion. The at least one edge camera has a field of view that images an alignment feature of the object within the field of view of the at least one edge camera of the wireless substrate-like sensor. A controller is disposed within the electronics housing and is coupled to the at least one edge camera. The controller is configured to obtain an image from the at least one edge camera and determine a location of the alignment feature and provide the determined location to the robotic substrate handling system.