The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.

The present disclosure relates to a technology of manufacturing electronic components, especially semiconductor components with an irregular shape. The present disclosure provides an improved alignment method and system which may be used in cases, where features on a top surface of the semiconductor component or device are not sufficient due to process limitations and where a bottom surface might also not show any alignment correlation with the top surface.

A substrate storage apparatus includes a stage on which a cassette that has a lid detachably mounted to an opening is disposed, a lid attaching/detaching plate that performs attaching/detaching of the lid to/from the opening of the cassette disposed on the stage, and is provided to be movable between a mounting position in contact with the lid disposed at a position of the opening and a retracted position not in contact with the lid disposed at the position of the opening, a lid holding sensor that detects whether the lid is being held by the lid attaching/detaching plate, and a controller that determines presence/absence of abnormality related to attachment/detachment of the lid based on a detection result of the lid holding sensor.

A substrate processing device includes a processing tank, a substrate holding unit, a fluid supply unit, and a control unit. The processing tank stores a processing liquid for processing a substrate. The substrate holding unit holds the substrate in the processing liquid in the processing tank. The fluid supply unit supplies a fluid to the processing tank. The control unit controls the fluid supply unit. The control unit controls the fluid supply unit such that the fluid supply unit changes supply of the fluid during a period from a start of supply of the fluid to the processing tank storing the processing liquid in which the substrate is immersed to an end of supply of the fluid to the processing tank storing the processing liquid in which the substrate is immersed.

An apparatus including at least one emitter configured to emit energy; at least one receiver configured to receive the emitted energy, where the at least one emitter is mounted on at least one of: a robot arm, an end effector of the robot arm, a substrate on the robot arm, or a substrate process module, where the at least one receiver is mounted on at least one of: the robot arm, the end effector of the robot arm, the substrate on the robot arm, or the substrate process module.

Disclosed are a device and a method for measuring a fretting displacement in a power cycling of a press-pack insulated gate bipolar transistor (IGBT). The IGBT includes: a bracket; slide bars slidably mounted on the bracket and are arranged at least four along a circumferential direction of the bracket; sensors respectively slidably installed on the bracket and the slide bars; and a power cycling experiment device arranged inside the bracket.

A state detection device includes at least one chuck pin for holding a substrate, a photographing unit configured to photograph the chuck pin, and set at least one image to be obtained as a target image, a matching coordinate calculation unit configured to perform matching processing between the target image and a reference image which is at least one image showing the chuck pin, and calculate matching coordinates, which are coordinates indicating a position of the reference image in the target image when a matching score between the reference image and the target image is the highest, and a detection unit configured to detect an open/closed state of the chuck pin based on the matching coordinates. Therefore, the open/closed state of the chuck pin can be detected while detection accuracy is suppressed from lowering.

A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

A method and an apparatus for bonding semiconductor substrates are provided. The apparatus includes a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other, a gauging component embedded in the first support and comprising a fiducial pattern, and a first sensor disposed proximate to the gauging component, and configured to emit a light source towards the fiducial pattern of the gauging component.

Described herein is a technique capable of properly attaching a nozzle to a reaction tube. According to one aspect thereof, there is provided a nozzle installation jig including: a lower plate configured to make contact with a process vessel in a vicinity of a lower end opening of the process vessel in which a nozzle is provided; a frame fixed to the lower plate and extending upward with respect to the lower plate; an upper plate fixed to the frame and provided with a sensor configured to detect a position of the nozzle in the process vessel; and a notification device configured to transmit a notification to an operator according to a detection result of the sensor.