The program code, when executed by a processor, causes the processor to input fabrication data including a plurality of parameters associated with a semiconductor fabricating process to a framework to generate a first class for analyzing the fabrication data, to extract a first parameter targeted for analysis and a second parameter associated with the first parameter from the plurality of parameters and generate a second class for analyzing the first parameter as a sub class of the first class, to modify the first parameter and the second parameter into a data structure having a format appropriate to store in the second class, so as to be stored in the second class, to perform data analysis on the first parameter and the second parameter, to transform the first parameter and the second parameter into corresponding tensor data, and to input the tensor data to the machine learning model.

A method and a system for controlling a lot risk score based dynamic lot measurement on the basis of equipment reliability index are provided. The method for controlling a measurement, according to an embodiment of the present invention, calculates an equipment reliability index of specific equipment for a specific process in semiconductor manufacturing, calculates a risk score of the specific equipment for the specific process on the basis of an equipment reliability index, and determines, on the basis of the risk score, whether to measure a semiconductor product processed by the specific equipment for the specific process. Therefore, differential quality monitoring and management is possible according to the equipment reliability index, a measuring instrument can be efficiently used, quality and yield can be improved through timely measurement, and management convenience can be increased through automatic and dynamic lot measurement control.

There is provided a transport control system assigning multiple jobs to an overhead hoist transport (OHT) based on the availability of linkage transporting and the likelihood of transport congestion. The transport control system includes: a plurality of transports, each of the plurality of transports transporting a carrier with a wafer loaded thereon; and a transport control apparatus controlling the plurality of transports and determining one of the plurality of transports as a target transport to which multiple jobs are to be assigned. The transport control apparatus determines one of the plurality of transports as the target transport based on a first element, which is the availability of linkage transporting, and a second element, which is the likelihood of transport congestion.

There is provided a technique that includes a process chamber configured to be capable of processing a substrate; a main controller configured to be capable of controlling the processing of the substrate; a storage configured to be capable of storing start-up condition execution status information used to determine whether or not a start-up condition is executed when the main controller is started, start-up condition management information for managing the start-up condition, and a state of the start-up condition management information; and a start-up condition controller configured to be capable of validating the start-up condition execution status information when the start-up condition management information satisfies a predetermined condition.

The present disclosure provides systems and methods for controlling a semiconductor manufacturing equipment. The control system includes an inspection unit capturing a set of images of the semiconductor manufacturing equipment, a sensor interface receiving the set of images and generating at least one input signal for a database server, and a control unit. The control unit includes a front end subsystem, a calculation subsystem, and a message and feedback subsystem. The calculation subsystem receives the data signal from the front end subsystem, wherein the calculation subsystem performs an artificial intelligence analytical process to determine, according to the data signal, whether a malfunction has occurred in the semiconductor manufacturing equipment and to generate an output signal. The message and feedback subsystem generates an alert signal and a feedback signal according to the output signal, and the alert signal is transmitted to a user of the semiconductor manufacturing equipment.

Provided is a technique capable of implementing efficient transport and processing related to multi-step processing in the case of a link-type vacuum processing apparatus with related to an operating method of a vacuum processing apparatus. The operating method of the vacuum processing apparatus according to the embodiment, in order to minimize time required for all processing of a plurality of wafers in a multi-step processing, includes a first step (steps 601 to 607) of selecting one first processing unit and one second processing unit from a plurality of processing units for each wafer and determining a transport schedule including a transport path using the selected processing units. In the first step, for at least one wafer, a transport schedule including a transport path is configured using the selected first processing unit by excluding at least one first processing unit from the plurality of first processing units. The operating method selects an optimal transport schedule when a second step is rate-limited.

Provided is a method for monitoring a plasma-related process in a plasma tool. The method includes measuring data associated with the plasma-related process using a plurality of sensors while executing the plasma-related process on a wafer. Respective data measured by each sensor of the plurality of sensors are input into a respective individual estimation method to output a respective individual wafer state of the wafer, which results in a plurality of individual wafer states. The respective individual estimation method is configured to estimate the respective individual wafer state using at least the respective data. The plurality of individual wafer states is input into an integrated estimation method to output an integrated wafer state of the wafer. The integrated estimation method is configured to estimate the integrated wafer state using at least the plurality of individual wafer states.

The present disclosure provides a host computer, and a control system and method of a machine. The host computer includes a control unit, a service configuration unit, and a functional flow unit. The control unit is configured to control a lower level computer to execute items of a functional flow of the machine. The service configuration unit is configured with action instruction information used to execute the functional flow of the machine and configured to interact with the control unit. The functional flow unit stores items of the functional flow of the machine edited by a user and is configured to interact with the control unit. A technical solution of the host computer and the control system and method of the machine may realize an editable function of the functional flow of the machine to improve flexibility, convenience, and a degree of automation of addition/modification of the functional flow.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.

A substrate processing apparatus includes a plurality of storage containers mounted on a load port, each storage container storing a plurality of substrates; a plurality of process chambers for accommodating the substrates; a transfer part for transferring the substrates; a memory for storing data tables, including first count data, for the process chambers; an operation part, when multiple substrates in the first storage container is transferred to the process chambers in a predetermined order and performs a predetermined process in the process chambers in a state in which no substrate is present in a first process chamber, counting first count data for the first process chamber; and a controller assigns flag data to a data table of a process chamber having largest first count data and when multiple substrates in the second storage container is transferred, control the transfer part based on the flag data from a different process chamber.