To measure the concentration of an oxidant in an oxidative cleaning liquid used in a process of cleaning an electronic material in a simple, easy, consistent, and accurate manner without being affected by impurities included in the cleaning liquid, such as metals. A method for measuring the concentration of an oxidant in a sample liquid used as a cleaning liquid in a process of cleaning an electronic material includes decomposing at least part of an oxidant included in the sample liquid by heating or the like; measuring the amount of oxygen gas generated by decomposition of the oxidant; and determining the concentration of the oxidant in the sample liquid on the basis of the amount of the oxygen gas.

A semiconductor process transport apparatus including a drive section with at least one motor, an articulated arm coupled to the drive section for driving articulation motion, a machine controller coupled to the drive section to control the at least one motor moving the articulated arm from one location to a different location, and an adapter pendant having a machine controller interface coupling the adapter pendant for input/output with the machine controller, the adapter pendant having another interface, configured for connecting a fungible smart mobile device having predetermined resident user operable device functionality characteristics, wherein the other interface has a connectivity configuration so mating of the fungible smart mobile device with the other interface automatically enables configuration of at least one of the resident user operable device functionality characteristics to define an input/output to the machine controller effecting input commands and output signals for motion control of the articulated arm.

A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.

A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.

A semiconductor manufacturing apparatus includes: an execution instruction receiving unit that receives an execution instruction for the semiconductor manufacturing apparatus to execute a predetermined process related to an operation control of the semiconductor manufacturing apparatus; an identification information receiving unit that receives an input of identification information of the semiconductor manufacturing apparatus; and an execution unit that executes the predetermined process according to the execution instruction of the predetermined process when identification information of the semiconductor manufacturing apparatus preset in the semiconductor manufacturing apparatus is the same as the identification information of the semiconductor manufacturing apparatus received by the identification information receiving unit.

There is provided a technique that includes at least one substrate processing apparatuses configured to process a substrate and comprising a first controller that is capable of controlling transmission of at least one type of data; a second controller that is capable of controlling operation of the at least one substrate processing apparatus; and a relay capable of receiving the data from at least one first controller and adjusting, when transmitting the data to the second controller, a reception interval from the first controller and a transmission interval to the second controller to be different from each other.

In a transfer system, at least one of a plurality of process apparatuses is connected to a station as a connected process apparatus. A station control unit controls a transfer device provided in the station through a communication with a process apparatus control unit to load the processing object to the connected process apparatus from the station and to unload the processing object from the connected process apparatus to the station. The station control unit controls the transfer device to begin unloading of the processing object from the connected process apparatus to the station after receiving a signal indicative of a presence of the processing object to be unloaded from the process apparatus control unit.

A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.

A substrate treating apparatus including an unloading order changing unit. The unloading order changing unit reverses an order, in regard to unloading of substrates in a carrier from the top, between a poor inclined substrate and a substrate at least immediately above the poor inclined substrate when the poor inclined substrate is present whose inclination is determined larger than a pre-set threshold by a poor inclination determining unit. That is, the order is reversed such that the poor inclined substrate whose surface may be possibly be scratched with a hand is unloaded prior to the substrate immediately above the poor inclined substrate. Accordingly, this inhibits damages on the substrate caused by scratching a substrate surface with the hand of a substrate transport mechanism.

One object of the present disclosure is to flexibly and promptly save a processing solution in an apparatus for processing a substrate. An apparatus for processing a substrate is configured to change over a transfer time table between an ordinary mode that has a maximum throughput of the apparatus for processing the substrate and a processing solution saving mode that saves a processing solution in at least one of processing tanks. The apparatus for processing the substrate determines whether or not the apparatus for processing the substrate is in a slack period that has a small demand output by the apparatus for processing the substrate, based on a rate-controlling point that limits a processing speed of the entire apparatus for processing the substrate, and sets the transfer time table to the processing solution saving mode when it is determined that the apparatus for processing the substrate is in the slack period, while setting the transfer time table to the ordinary mode when it is determined that the apparatus for processing the substrate is not in the slack period.