An automated module for assembly lines to assemble electronic devices includes a plurality of cells. Each cell includes a support structure, a control unit and at least one actuating system, operatively connected to the control unit for receiving commands and transmitting the results obtained as data to and from the control unit. The automated module includes at least one moving device, for moving at least one electronic device among the module's cells; and a supervision unit. The supervision unit interacts with each control unit of each cell, thus sending commands to control each single cell and receiving respective results from the respective control units as data; and to control the moving device for its activation, to move the electronic devices among the cells. The cells are independent and are assembled in a modular manner in the desired sequence, to perform a desired sequence of operations on the electronic device.

A method for manufacturing a semiconductor wafer including: slicing off a plurality of wafers from an ingot; chamfering outer peripheral portions of the plurality of sliced wafers; and performing double-side polishing to polish both surfaces of each wafer whose outer peripheral portion is held by a carrier, wherein includes performing warp direction adjustment to uniform directions of warps of the plurality of wafers in one direction after the slicing and before the chamfering, and the chamfering and the double-side polishing are performed in a state where the directions of the warps of the plurality of wafers are uniformed in one direction after the warp direction adjustment. Consequently, it is possible to provide the method for manufacturing a semiconductor wafer which can suppress degradation of flatness of the double-side polished wafers even in case of uniforming the directions of the warps of the wafers in one direction before the double-side polishing.

A laser processing apparatus includes: a chuck table that holds a packaged wafer; a laser beam applying unit that applies a pulsed laser beam to the packaged wafer; X-axis moving unit for moving the chuck table in an X-axis direction; an imaging unit that images the packaged wafer; and a control unit. The chuck table has a transparent or semi-transparent holding member and a light emitting body. The control unit includes: an imaging instruction section that causes the imaging unit to image the packaged wafer while the pulsed laser beam is being applied to the packaged wafer; and a determination section that determines the processed state of a through-groove from a picked-up image obtained according to an instruction by the imaging instruction section.

Apparatus and method for aligning a rotatable substrate to a support mechanism to write a feature to the substrate, and a substrate so configured. In some embodiments, the substrate has a circumferentially extending timing pattern with spaced apart first and second timing marks disposed on opposing sides of a center point of the timing pattern and an identification (ID) field that stores a unique identifier value associated with the substrate. Upon mounting of the substrate to a support mechanism that rotates the substrate about a central axis that is offset from the center point, a control circuit generates a compensation value to compensate for the offset using the first and second timing marks and outputs a process instruction to authorize processing of the substrate using the unique identifier value. In some cases, the unique identifier value is used as a lookup to a computerized database.

A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

A method for making integrated circuit (IC) packages includes providing a leadframe strip having a plurality of leadframe units and providing the leadframe strip to an operating station. The operating station is operable to perform one or more tests on the plurality of leadframe units in the making of IC packages. The method includes obtaining a database that has the locations of leadframe units in the leadframe strip stored in the database. The method also includes performing the one or more tests on the plurality of leadframe units and updating the database in response to the results of the testing.

Apparatus and method for aligning a rotatable substrate to a support mechanism such as a turntable. The substrate has a circumferentially extending timing pattern comprising at least spaced apart first and second timing marks disposed on opposing sides of a center point of the substrate. The substrate is configured to be mounted to and rotated by the support mechanism about a central axis. The center point of the substrate may be offset from the central axis by an offset distance due to mechanical tolerances associated with the substrate mounting operation. The offset distance may be determined through successive detection of the first and second timing marks by a detector over at least one rotation of the support mechanism and the substrate. A write beam may be adjusted using the determined offset distance to write a second feature to the substrate in alignment with a previously written first feature.

The present application relates to methods for compensating for die shift during compression molding of semiconductor dies. The method includes using a compensated marked carrier which includes a plurality of physical carrier markings derived from original projected markings. These original projected markings are generated through projection of original virtual carrier markings, based on a green file, and are transformed by applying a compensation factor in a computing apparatus. The method includes steps of bonding semiconductor dies onto the compensated marked carrier using the physical carrier markings, and performing compression molding to encapsulate the semiconductor dies into a molded panel. This process adjusts the original gap between adjacent semiconductor dies to a compensated gap, thereby compensating for die shift induced during molding. Additionally, the disclosure encompasses methods for fabricating the compensated marked carrier and applying these methods in a panel-level semiconductor packaging process.

According to an aspect herein, there is provided a method of decorating multiple parts, the method includes: loading a plurality of parts onto a pallet; registering location of each of the plurality of parts in relation to the pallet; registering location of each of the plurality of parts with each of a plurality of templates; decorating the plurality of parts using the plurality of templates; and inspecting the decorated parts to monitor for defects. According to another aspect herein, there is provided a method of decorating a part, the method includes: positioning a part for decoration; starting a decoration process for the part; and adjusting one or more parameters of the decoration process during the decoration process based on predetermined characteristics of the part or the decoration to provide for enhanced print coverage or quality.

An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.