Disclosed herein is a wafer processing method including a processed position measuring step of imaging an area including a beam plasma generated by applying a pulsed laser beam to a wafer, by using an imaging unit during the formation of a laser processed groove on the wafer, and next measuring the positional relation between the position of the beam plasma and a preset processing position. Accordingly, it is possible to check whether or not the laser processed groove is formed at a desired position, in real time during laser processing. If the position of the laser processed groove is deviated, the processed position can be immediately corrected.

A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes forming a peripheral modification layer along a boundary between a peripheral portion of the first substrate as a removal target and a central portion of the first substrate; forming a non-bonding region in which bonding strength between the first substrate and the second substrate at the peripheral portion is reduced; forming a reference modification layer, which serves as a determination reference of a formation position of either the peripheral modification layer or the non-bonding region, at a non-bonding surface of the first substrate not bonded to the second substrate; and removing the peripheral portion starting from the peripheral modification layer.

An inkjet printing system and method for processing wafers in a high volume are disclosed. The inkjet printing system includes a chuck on which a wafer can be placed and an inkjet printing head with at least one nozzle. Each chuck is associated with a single camera. Each chuck includes a 2-dimensional visual reference. An electronic controller assembly is configured to take a single image containing the wafer edge and the 2-dimensional visual reference each instance a wafer has been placed on a chuck. For each image, the position of the chuck relative to the camera and the position of the wafer relative to the camera are determined. Subsequently, the wafer position relative to the chuck is calculated and based on that the firing of the at least one nozzle is timed and the movement of the printing motion assembly is controlled so that the liquid drops are accurately positioned on the wafer.

The present disclosure provides a method for manufacturing a semiconductor device, comprising: a first process of forming a first layer on a main surface of a wafer, wherein the first layer has a reference mark for measuring a positional deviation of a resist relative to a first element pattern for a semiconductor element; a second process of forming the resist on the first layer to cover the reference mark and the first element pattern; a third process of exposing and developing the resist to form a positional deviation determination pattern overlapping the reference mark in a plan view; a peripheral pattern surrounding the positional deviation determination pattern in the plan view; and a second element pattern for the semiconductor element; and a fourth process of determining a positional deviation of the second element pattern with respect to the first element pattern.

A substrate processing apparatus includes stages each placing a substrate thereon, support columns supporting the stages, a common base supporting the support columns, and a position adjustment mechanism provided between the base and each support column. The position adjustment mechanism includes: a fixed member on a side of the base; a position adjustment member disposed above the fixed member and adjusting a position of the stage by positioning a base end portion of the support column; and gap height adjustment parts provided at at least three positions surrounding the support column, and mounting the position adjustment member to the fixed member in a state where a gap height between the fixed member and the position adjustment member is adjustable. At least one position adjustment mechanism is provided with a fixedly mounting part mounting the position adjustment member to the fixed member in a state where the gap height is fixed.

Disclosed is a wafer marking method using a laser for marking a wafer having processing tape attached thereto. The disclosed laser marking method comprises the steps of: penetrating a 532-nm wavelength laser beam through the processing tape attached to one side of the wafer; and performing marking on the one side of the wafer by moving the 532-nm wavelength laser beam at a predetermined velocity, wherein the 532-nm wavelength laser beam has a frequency of 8 kHz to 40 kHz, and an output power of 0.8 W to 2 W.

Disclosed herein is a wafer processing method including a processed position measuring step of imaging an area including a beam plasma generated by applying a pulsed laser beam to a wafer, by using an imaging unit during the formation of a laser processed groove on the wafer, and next measuring the positional relation between the position of the beam plasma and a preset processing position. Accordingly, it is possible to check whether or not the laser processed groove is formed at a desired position, in real time during laser processing. If the position of the laser processed groove is deviated, the processed position can be immediately corrected.

Disclosed is a method for marking, by using a laser marker, a plurality of wafer dice divided by a wafer dicing process. The disclosed marking method for wafer dice comprises the steps of: setting a plurality of scan regions having a mutually overlapping portion on a wafer including the wafer dice; scanning the scan regions of the wafer a plurality of times by using a line scan camera; collecting position information of each of wafer dice located in regions in which the scan regions do not overlap; collecting, through image synthesis, position information of each of wafer dice located in regions in which the scan regions overlap; and marking, by using the laser marker, each of all the wafer dice of which the position information has been collected.

A method of manufacturing a stacked semiconductor package includes forming a semiconductor package, the semiconductor package having one or more semiconductor chips on an upper surface of a printed circuit board (PCB), and a mold layer covering the upper surface of the PCB, marking the semiconductor package with an identification mark by scanning a laser of a laser supply apparatus onto the semiconductor package, controlling a focus level of the laser, and performing laser drilling on the mold layer of the semiconductor package to form openings.