There is provided a configuration at least including a screen control part configured to display on a display part a maintenance component management screen displaying a component, a mechanism, or both, as a maintenance component, a collection part configured to collect component data related to the maintenance component, a determination part configured to compare a cumulative value of the component data with a predetermined threshold value to determine the cumulative value exceeding the threshold value, a calculation part configured to calculate a replacement time, and an operation part configured to calculate replacement times based on an average value of the component data and a cumulative value of the component data for each predetermined cycle, display the maintenance component sequentially from the maintenance component reaching the earliest replacement time, and display the maintenance component on the display part in a state where the component data is updated for the predetermined cycle.

In an embodiment, a system includes: an orientation sensor configured to detect an orientation fiducial on a bevel of a wafer; a pedestal configured to rotate the wafer to allow the orientation sensor to detect the orientation fiducial and place the orientation fiducial at a predetermined orientation position; and a defect sensor configured to detect a wafer defect along a surface of the wafer while rotated by the pedestal.

A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

The present disclosure provides a technology for holding a substrate with high precision and a high degree of flatness. A substrate holding device of the present disclosure comprises: a rotary stage; and a clamp part that supports, in a planar direction of the substrate, an edge of a substrate which is the object to be rotated by the rotary stage. The rotary stage is provided with: a plurality of gas supply openings that supply a gas toward the substrate; and one or more gas exhaust openings that are provided to each of the plurality of gas supply openings so as to surround the periphery of the gas supply opening.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber configured to treat a substrate; a transfer assembly configured to transfer the substrate to the process chamber; and a diagnosis unit configured to detect an abnormal state of the transfer assembly, and wherein the transfer assembly comprises: a housing having a transfer space; and a transfer robot configured to transfer the substrate to the process chamber, and wherein the diagnosis unit comprises: a detection member for detecting an air vibration generated within the housing; and a diagnosis member for diagnosing a driving unit of the transfer assembly based on the air vibration detected by the detection member.

A stage apparatus for holding a substrate, including a substrate holding unit including a holding surface that holds the substrate, a driving mechanism configured to transfer the substrate to the holding surface, and a control unit configured to decide, based on warpage information concerning warpage of the substrate measured while the substrate is supported by a supporting surface smaller than the holding surface, a driving profile of the substrate by the driving mechanism in a height direction of the substrate such that the substrate is transferred to the holding surface while the warping of the substrate is corrected.

A FinFET structure with a gate structure having two notch features therein and a method of forming the same is disclosed. The FinFET notch features ensure that sufficient spacing is provided between the gate structure and source/drain regions of the FinFET to avoid inadvertent shorting of the gate structure to the source/drain regions. Gate structures of different sizes (e.g., different gate widths) and of different pattern densities can be provided on a same substrate and avoid inadvertent of shorting the gate to the source/drain regions through application of the notched features.

The present invention relates to defects inspection on a silicon carbide wafer or an epitaxial layer thereon to determine the location, and adjustment of the location of the scribe line, which is a separation line forming a gap between adjacent dies. The present invention can obtain high efficiency and economy in the semiconductor process using wafers containing various defects in the surface and thin film, by minimizing the effect of wafer defects on the final yield of the semiconductor chip or die, via adjustment of scribe line positions arranged on the wafer.

An apparatus includes a beam conditioning assembly configured to output one or more wavelengths to a substrate being processed and receive one or more reflected wavelengths from the substrate, and a machine learning device configured to process the one or more reflected wavelengths to predict a process variable and compare the predicted process variable with a measured process variable to obtain a comparison result.