A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.

A wafer forming apparatus includes a conveying tray having an ingot accommodating section that accommodates a semiconductor ingot and a wafer accommodating section that accommodates a wafer formed from the semiconductor ingot, a belt conveyor unit that conveys the conveying tray to each processing apparatus, a cassette rack on which cassettes accommodating the wafers are placed correspondingly to the conveying trays, and a transferring unit that transfers the wafer from the wafer accommodating section of the conveying tray to the cassette placed on the cassette rack. The conveying tray is provided with an identification mark. The cassette rack or the cassette corresponding to the conveying tray is provided with the same identification mark as the identification mark provided on the conveying tray.

A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.

A wafer transport container interior atmosphere measurement device is arranged in wafer transport container. The device detects an atmosphere in the wafer transport container and communicates the atmosphere. The device includes a detector, a transmitter, and a power source. The detector detects the atmosphere in the wafer transport container. The transmitter wirelessly transmits a first information including a detection result by the detector to an external receiver. The power source supplies electric power to the detector and the transmitter.

The invention discloses a container for accommodating a substrate. The container includes a base having at least one first supporting surface and a lid having at least one second supporting surface to engage with the first supporting surface of the base, so as to define an accommodating space for the substrate. The first supporting surface of the base and the second supporting surface of the lid have the same slope with a respective flatness of 0.04 mm or less, so that an effective hermetic seal between the first supporting surface and the second supporting surface is formed when the two surfaces contact each other.

The invention discloses a reticle pod including a base and a lid mounted to the base. The base has a bottom surface having at least one first mark and at least one second mark. The first mark has a first reflectivity relative to a light source, and the second mark has a second reflectivity relative to the light source. The first reflectivity is different from the second reflectivity, and both are also different from that of the rest area of the bottom surface.

Authentication information is acquired from a storage medium through near field communication in one authentication device. Whether the authentication information corresponds to one substrate processing apparatus at which the authentication device is provided is determined. In a case where the authentication information corresponds to the one substrate processing apparatus, access information is transmitted from the authentication device through near field communication. An instruction terminal receives the access information through near field communication. The instruction terminal accesses a maintenance instruction device based on the access information, whereby a maintenance screen is displayed on a display of the instruction terminal. The instruction terminal has an operation unit to be operated by a user in order to provide an instruction for performing a maintenance operation.

A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.

The present invention discloses a method for preparing a bifacial PERC solar cell. The present invention has high photoelectric conversion efficiency, high appearance quality, and high EL yield, and could solve the problems of both scratching and undesirable deposition.

Systems for annealing a wafer are provided. A system includes a wafer stage, a laser beam generator, and a controller. The laser beam generator is configured to generate a laser beam. The controller is configured to control the laser beam generator according to information regarding layout of a first semiconductor die of the wafer, so as to project the laser beam with a first laser parameter onto the first semiconductor die of the wafer on the wafer stage along at least one annealing orbit. The controller is configured to arrange the annealing orbit to partially cover the first semiconductor die of the wafer and to uncover a plurality of second semiconductor dies of the wafer.