A semiconductor processing apparatus including: a substrate comprising a polymer material layer; and a conductive polymer coating layer that coats at least a portion of the polymer material layer of the substrate, wherein the conductive polymer coating layer comprises conjugated polymers, wherein the conductive polymer coating layer has a total extractable metals less than 400 ng/g, and wherein the conductive polymer coating layer is configured to discharge electrostatic buildup in the semiconductor processing apparatus when connected to a semiconductor processing system.

A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting the plate-shaped objects when a plurality of plate-shaped objects is stored in an up-and-down direction includes a ring-shaped abutment portion and a control portion. An upper face and a lower face in the abutment portion have an approximately flat shape and the upper face in the abutment portion abuts against a lower face of a peripheral edge portion of the plate-shaped object. The lower face in the abutment portion abuts against an upper face of the peripheral edge portion of the plate-shaped object. The control portion includes a control portion upper face positioned to protrude further upward than the support face of the abutment portion and a control portion lower face positioned at an appropriate location in a thickness direction of the abutment portion.

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

A front opening wafer container with a forward and rearward sets of stacked V-shaped wafer edge receiving portions, the rearward set part of a wafer shelf component and comprising a thin film of PBT preformed and overmolded with a polycarbonate. The sets of stacked V-shaped wafer edge receiving portions providing between-shelf seating positions above on-shelf seating positions. The PBT providing a low friction sliding engagement surface for the wafer edges thereby providing uniform and consistent dropping of wafers from the between shelf position to the on-shelf position when the door of the wafer container is removed.

A substrate storing container includes a container main body, a lid body, and a lateral substrate support portion. The lateral substrate support portion of the substrate storing container includes substrate contact portions touching a substrate when supporting an edge portion of the substrate, and contact portion support portions supporting the substrate contact portions. The substrate contact portions are made of a material having a heat-resisting property with respect to temperature of the substrate touching the substrate contact portions. The contact portion support portions are made of a material having a lower heat-resisting property than that of the substrate contact portions and having a lower coefficient of moisture absorption than that of the substrate contact portions.

The invention relates to a packaging unit for substrates, a packaging stack having packaging units of this type and a method for packaging substrates. The packaging unit for substrates comprises a first substrate, a spacer and a second substrate. The spacer is placed on the first substrate and the second substrate is placed on the spacer. A respective metal deposit is applied to a surface of the first substrate and to a surface of the second substrate and a respective adhesive point is arranged on the two metal deposits. The spacer is placed on the first substrate in such a way that the spacer is only in contact with the first substrate outside of the adhesive point. The spacer is bridge-shaped. At least the first substrate comprises a plurality of individual substrates arranged next to one another and the spacer borders the individual substrates.

A wafer container that reduces or alleviates one or more of the problems associated with excessive container wall deflection due to loading and excessive particulate generation, particularly as those problems are experienced with containers for 450 mm diameter and larger wafers. The container has an enclosure and door with interlocking features to enable transfer of tension load to the door to minimize deflection of container surfaces. The container may include a gasketing arrangement compatible with the interlock feature. The container may include a removable door guide that improves centering of the door during door installation, and that is made of low particle generating material to reduce particulates.

A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×10.sup.7 to 1×10.sup.8 Ω/sq.

A storage container with improved strength and airtightness, and a method for manufacturing the storage container are provided. The storage container includes, as a functional resin member, an insert component for a container body insert-molded with a molding material containing predetermined resin. The functional resin member is a side wall plate with support pieces. The side wall plate has a thick portion having at least a thickness of a side wall of the container body, and a thin joint portion formed around the thick portion, to be interposed into and joined to a peripheral wall of the container body. Most of the peripheral wall and the thin joint portion are engaged and joined to enlarge their contact area to eliminate a decrease of the mechanical strength and leakage around the peripheral edge of the side wall plate and prevent the peripheral wall from parting from the side wall plate.

The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.