The present disclosure provides a carrying device and a semiconductor processing apparatus. The carrying device includes a heating plate and a cooling plate, the heating plate and the cooling plate are spaced apart, and a thermal insulation region is formed between the heating plate and the cooling plate. The carrying device of the present disclosure not only can preempt the need to stop the process due to excessively high temperature, but also can maintain a uniform and stable temperature throughout the process, thereby providing a qualified and stable processing temperature for a workpiece to be processed, and eventually obtaining better processing results.

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

A substrate storing container includes a container main body, a lid body, and a lateral substrate support portion. The lateral substrate support portion of the substrate storing container includes substrate contact portions touching a substrate when supporting an edge portion of the substrate, and contact portion support portions supporting the substrate contact portions. The substrate contact portions are made of a material having a heat-resisting property with respect to temperature of the substrate touching the substrate contact portions. The contact portion support portions are made of a material having a lower heat-resisting property than that of the substrate contact portions and having a lower coefficient of moisture absorption than that of the substrate contact portions.

An apparatus having a first portion including first front wall, first rear wall, and bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having second front wall, second rear wall, and top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between an open and closed configurations.

A substrate transfer apparatus includes: a chamber including a lower surface, an upper surface opposing the lower surface, and a side surface extending between the lower surface and the upper surface; and a fan filter unit disposed on the upper surface of the chamber and configured to introduce air into the chamber. The chamber includes an inclined surface extending from the upper surface to the side surface and positioned to a side of the fan filter unit.

A liquid crystal panel package with water absorption ability is provided and comprises a box body and a water absorbent, wherein a containing groove is formed on the box body, the water absorbent is disposed within the containing groove and expands to partially protrude out of the containing groove after absorbing moisture in air, and the protruded part of the water absorbent is configured to abut another liquid crystal panel package stacked with the box body. The liquid crystal panel package with water absorption ability in the disclosure provides the water absorbent on box body so that the water absorbent expands and closely contacts with another liquid crystal panel package stacked thereon after absorbing moisture to fully fill the gap between the stacked two box bodies, and thereby prevents moisture from entering the package.

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

A stocker includes a wall that separates inside and outside of the stocker, a storage area on an inner side of the wall to store articles, a duct on a wall side of the storage area and extending in a vertical direction, an inlet at an upper end of the duct to introduce air flowing downward into the duct, a flow regulator to regulate an airflow between an upper side and a lower side of the duct, blowout openings on a storage area side of the duct to blow out air to the storage area, and a fan on a lower side of the flow regulator of the duct to draw in outside air and introduce the outside air into the duct.

An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 110.sup.7 /sq to 110.sup.8 /sq.

The invention discloses a reticle pod including a base and a lid mounted to the base. The base has a bottom surface having at least one first mark and at least one second mark. The first mark has a first reflectivity relative to a light source, and the second mark has a second reflectivity relative to the light source. The first reflectivity is different from the second reflectivity, and both are also different from that of the rest area of the bottom surface.