A packing article for the storage and/or transport of items and materials requiring high levels of cleanliness is described. Methods of making and using the packaging article are also described. The packaging article may be used to store or transport, for example, advanced optical components, or materials and components used in the manufacturing of microelectronic devices or optical components. A method of making the packaging article includes contacting the packaging article with organic solvent(s) and acidic solution(s) and rinsing with ultrapure water. Interior cleanliness levels for various contaminants, such as, metals, anionic materials, organic compounds, and particles may be verified and the packaging articles may be labeled and sorted according to cleanliness level.

A transport container transports semiconductor wafers. The transport container includes: a mandated 3D printed shape, including a device in a base that is suitable for removing liquid media; and at a surface of the transport container, a coating material configured for protection from chemicals capable of etching the wafers. The coating material is applied by of a low-temperature coating process. The coating material consists of polytetrafluoroethylene, perfluoroalkoxy polymer, or polyvinylidene fluoride. The mandated form of the transport container also includes an integrated workpiece holder for the wafers or carriers for the wafers, configured such that that the wafers to be transported are loadable in standing form. The transport container is configured for a designated transport direction of the transport container in an automatic transport system that runs parallel to a front or rear side of the semiconductor wafers.

A reticle pod for accommodating a reticle is provided. The reticle pod comprises a base; a cover; and at least one supporting member. When the reticle is accommodated on the reticle pod, the supporting member abuts against the reticle through a protrusion part; wherein the maximum static friction is constantly greater than a horizontal force applied to the support module from the reticle.

A method of manufacturing a semiconductor device includes: forming a protective material composed of a polymer having a urea bond by supplying a raw material for polymerization to a surface of a substrate for manufacturing the semiconductor device, the protective material configured to protect a protection target layer provided in the substrate against a treatment to be performed on the substrate; subsequently performing the process on the substrate on which the protective material is formed; and subsequently removing the protective material by heating the substrate under a low oxygen atmosphere to depolymerize the polymer.

A method of modifying a substrate carrier to improve process performance includes depositing material or fabricating devices on a substrate supported by a substrate carrier. A parameter of layers deposited on the substrate is then measured as a function of their corresponding positions on the substrate carrier. The measured parameter of at least some devices fabricated on the substrate or a property of the deposited layers is related to a physical characteristic of substrate carrier to obtain a plurality of physical characteristics of the substrate carrier corresponding to a plurality of positions on the substrate carrier. The physical characteristic of the substrate carrier is then modified at one or more of the plurality of corresponding positions on the substrate carrier to obtain desired parameters of the deposited layers or fabricated devices as a function of position on the substrate carrier.

To provide a substrate storage container capable of keeping low a relative humidity in an internal closed space for a long period of time even after purging, a substrate storage container including a constitutive material, which includes a shell body, a door and an on-off valve, defining the internal closed space, the constitutive material being formed of a specific constitutive material having a water absorption of 0.1 wt. % or less when immersed in water at 23 degree C. for 24 hours, and thereby, an actual requirement is objectively satisfied in terms of water release suppression ability under JIS K 7209 or ISO 62 to significantly suppress releasing of water into the internal closed space 3 through the shell body, the door and the on-off valve.

A substrate processing method includes a phosphoric acid processing step, a coarse rinse processing step, and a single-substrate drying processing step. In the phosphoric acid processing step, a plurality of substrates are immersed in phosphoric acid inside a processing tank. In the coarse rinse processing step, after the phosphoric acid processing step, a part of the phosphoric acid adhering to the plurality of substrates is replaced with a first rinse liquid to an extent that the phosphoric acid remains in patterns of the plurality of substrates. In the single-substrate drying processing step, the plurality of substrates are dried one by one after the coarse rinse processing step.

A Front-Opening Unified Pod (FOUP), and more particularly an injection molded liquid crystal polymer article used in making the FOUP which both positive CTE value and shrinkage values and similar expansion and shrinkage of the article in both the MD and TD directions.

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.