A mark printing device includes a driving unit driving along a driving rail of an overhead hoist transport, a printing unit being configured to print on the driving rail a mark for guiding a motion of a vehicle, a data processing unit receiving design data including design information of the driving rail and first information on a position and type of the mark from a server, an encoder unit being configured to calculate a rotation amount of a servo motor provided in the driving unit to detect a current position of the driving unit and a driving distance of the driving unit, and a control unit being configured to control the driving unit and the printing unit to print the mark on the driving rail by using the design data and second information on the current position and the driving distance of the driving unit.

A vertical batch furnace assembly for processing wafers having a cassette handling space, a wafer handling space, and a first wall and separating the cassette handling space from the wafer handling space. The first wall has at least one wafer transfer opening in front of which, at a side of the first wall which is directed to the cassette handling space, a wafer transfer position for a wafer cassette is provided. The cassette handling space comprises a cassette storage having a plurality of cassette storage positions and a cassette handler configured to transfer wafer cassettes between the cassette storage positions and the wafer transfer position. The cassette handler has a first cassette handler arm and a second cassette handler arm.

An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.

A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.

In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.

An apparatus for transferring chips from a first position to at least a second position includes: a rotatable transfer assembly including at least two transfer heads, each head for picking up a chip in the first position, and positioning the chip in the at least second position through rotation of the transfer assembly about an axis of rotation; a transfer assembly actuator for driving the transfer assembly together with the at least two transfer heads about the axis; and at least a first transfer head actuator structured for actuating at least one transfer head in a radial direction relative to the axis, the at least first transfer head actuator being mounted to the rotatable transfer assembly actuator and including an actuator element coupled to the at least one transfer head, the actuator element structured to be actuated in the direction of the axis relative to the rotatable transfer assembly actuator.

A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.

According to one embodiment, there is provided a substrate bonding apparatus including a first chucking stage, a second chucking stage, and an alignment unit. The first chucking stage is configured to chuck a first substrate. The second chucking stage is disposed facing the first chucking stage. The second chucking stage is configured to chuck a second substrate. The alignment unit is configured to be inserted between the first chucking stage and the second chucking stage. The alignment unit includes a base body, a first detection element, and a second detection element. The base body includes a first main face and a second main face opposite to the first main face. The first detection element is disposed on the first main face. The second detection element is disposed on the second main face.

An overhead transport vehicle system includes an overhead transport vehicle including a traveler and a body supported by the traveler via a suspension to hold an object to be transported, and a traveling rail including a slit, through which the suspension is movable when the traveler travels, and rolling portions along which traveling wheel rolls, and having a tubular shape including an internal space through which the traveler travels. In the internal space in a curved section, above a passing area through which the traveling wheel rolling on the rolling portion on an outer side of a curve passes, a rising restriction portion, with which the traveling wheel having risen by a predetermined amount from the rolling portion comes into contact, extends along an extending direction of the traveling rail.

A target provided to a substrate placement portion is detected by an object detection sensor at a plurality of rotation positions of the substrate placement portion. An index length which is a distance from a robot reference axis to the target in a direction perpendicular to an axial direction, or information correlated therewith, is calculated. At least one of a rotation position of a detection line about the robot reference axis and a rotation position of the substrate placement portion about a rotation axis when the target located on a line connecting the robot reference axis and the rotation axis is detected is calculated on the basis of the calculated index length or the calculated information correlated therewith. A direction in which the rotation axis is present as seen from the robot reference axis is specified on the basis of the calculated rotation position.