A transport system, including: a sensor, a controller and a power panel. The sensor determines a zone and sends a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to output a current in accordance with the output signal for driving vehicles in the zone, wherein the current is outputted to a cable extending through the zone.

A method and apparatus for loading substrates in an inspection station is disclosed herein. In one embodiment a loading module is disclosed that includes a loading station for two or more substrate cassettes, a first lane comprising a first conveyor that is substantially aligned with one of the two or more substrate cassettes and a conveyor system, a second lane comprising a second conveyor that is substantially aligned with another of the two or more substrate cassettes and positioned in a spaced-apart relation relative to the first lane, and a lateral transfer module positioned between the first lane and the second lane that is adapted to move substrates from the second lane to the first lane.

The present disclosure provides a device (300) for degumming and inserting silicon wafers and method for processing silicon wafers. The device (300) for degumming and inserting silicon wafers includes a material frame (1), a grabbing mechanism (2), a degumming mechanism (3), an unlocking mechanism (8) and an inserting mechanism (4). The material frame (1) is configured for placing and clamping a plurality of silicon wafers (100) bonded with a support (200), the grabbing mechanism (2) is configured for grabbing and transferring the material frame (1) or the support (200), the degumming mechanism (3) is configured for degumming the plurality of silicon wafers (100) from the support (200), the unlocking mechanism (8) is configured for releasing clamping and fixing of the material frame (1) on the plurality of silicon wafers (100), and the inserting mechanism (4) is configured for splitting the degummed plurality of silicon wafers (100).

The article transport vehicle includes a travel section, a holding section, an elevating device, an inclination detection device, an inclination adjustment device, and an inclination control device for controlling the inclination adjustment device. The inclination adjustment device is configured to act on a target belt among a plurality of suspension belts to adjust an inclination of the holding section by adjusting a suspension height at which the holding section is held by the target belt. During the lowering of the holding section to the transfer position by the elevating device, the inclination control device executes an adjustment operation during lowering, in which the inclination of the holding section is detected by the inclination detection device, and based on the result of the detection performed by the inclination detection device, the inclination adjustment device is controlled to adjust the inclination of the holding section.

A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

An automated warehouse includes a placement section module that is slidably supported by a frame member via a slide mechanism. The slide mechanism supports the placement section module in such a manner that the placement section module is slidable relative to the frame member between a reference position and a protruding position. A cover member covers a face of the placement section module on a back face side in a depth direction. When the placement section module is at the protruding position, an upper side of storage regions is exposed.

The disclosed technology generally relates to semiconductor processing and more particularly to placing a substrate in a semiconductor manufacturing equipment for processing, and to apparatuses for placing the substrate in the semiconductor manufacturing equipment. In one aspect, a method of calibrating a process position of a semiconductor substrate in a process chamber comprises securing a calibration substrate on a susceptor in a processing chamber under an open chamber condition using a securing device, wherein securing comprises preventing the substrate from sliding laterally on the susceptor by more than a predefined tolerance from a centered position relative to a susceptor center. The method additionally comprises subjecting the calibration substrate under a process condition different from the open chamber condition. The method additionally comprises transferring the calibration substrate from the susceptor using a robot arm. The method further comprises detecting a position of the calibration substrate and recording coordinates of the robot arm corresponding to the detected position of the calibration substrate. Detection can be conducted on the fly. The securing device can be removed prior to processing substrates.

A vertical batch furnace assembly for processing wafers having a cassette handling space, a wafer handling space, and a first wall and separating the cassette handling space from the wafer handling space. The first wall has at least one wafer transfer opening in front of which, at a side of the first wall which is directed to the cassette handling space, a wafer transfer position for a wafer cassette is provided. The cassette handling space comprises a cassette storage having a plurality of cassette storage positions and a cassette handler configured to transfer wafer cassettes between the cassette storage positions and the wafer transfer position. The cassette handler has a first cassette handler arm and a second cassette handler arm.

The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.

A system for transferring a substrate includes a substrate transporter at which is captured a first image with which a position of the substrate at the substrate transporter is determined; a tray at which is captured a second image with which a position of each of a plurality of substrates relative to the tray is determined; a substrate mover with which the substrate is movable in a revolving manner between the substrate transporter and the tray, the substrate mover including: an arm portion movable in the revolving manner between the substrate transporter and the tray, and a substrate securing portion movable together with the arm portion; and an imager with which the first image and the second image are captured, the imager connected to the arm portion and movable in the revolving manner between the substrate transporter and the tray together with the arm portion.