A substrate treating apparatus and a substrate transporting method wherein a platform is disposed on a first ID block, and a platform is placed on a second ID block. A currently-used carrier platform is provided only on the first ID block. Accordingly, a substrate is transported in both a forward path and a return path between the first ID block and a second treating block. The substrate is returned not to the first ID block but to the second ID block disposed between the two treating blocks in the return path.

A substrate processing system includes a protective film forming liquid supplying unit which supplies a protective film forming liquid to one surface of a substrate, a protective film forming unit which solidifies or hardens the protective film forming liquid and forms a protective film on the one surface of the substrate, a suction unit which suctions the one surface of the substrate, a processing unit which executes predetermined processing with respect to the other surface of the substrate in a state that the one surface of the substrate is suctioned by the suction unit, and a removing liquid supplying unit which has a removing liquid discharge port that discharges a removing liquid being capable of removing the protective film and supplies the removing liquid toward the one surface of the substrate from the removing liquid discharge port.

Provided is a method, device, and program for determining a timing of removing a substrate from a cassette in substrate processing device, and substrate processing device. In the method, a tentative removal time point of each substrate is calculated by adding a transfer time to a tentative removal time point of the one previous substrate, wherein the transfer time is required from the start of an action of removing a substrate from the cassette to the end of an action of delivering the substrate to an exchanger.

The present disclosure relates to a substrate transfer apparatus. The substrate transfer apparatus includes a first transfer apparatus, a second transfer apparatus, a substrate carrier driver, a sensor, a swing apparatus, and a controller. The first transfer apparatus is configured to transfer a substrate in a first direction. The second transfer apparatus is configured to receive the substrate from the first transfer apparatus and transfer the substrate and comprising a substrate carrier on which the substrate transferred from the first transfer apparatus is seated. The substrate carrier driver is configured to move the substrate carrier. The sensor is configured to detect an abnormal transfer of the substrate from the first transfer apparatus to the second transfer apparatus and generate a detection signal corresponding to the abnormal transfer of the substrate. The swing apparatus is configured to swing the substrate carrier. The controller is connected to the sensor and the swing apparatus and configured to control the swing apparatus based on the detection signal of the sensor.

An illustrative embodiment disclosed herein is an apparatus including a first loading tray configured to couple to a first wafer holding device holding a plurality of wafers. The first wafer holding device includes a first opening. The apparatus includes a second loading tray configured to couple to a second wafer holding device. The second wafer holding device includes a second opening. The apparatus includes a first motor coupled to the first loading tray and configured to rotate the first wafer holding device until the first opening faces the second opening to allow transfer of the plurality of wafers from the first wafer holding device to the second wafer holding device.

A developing device and a developing method of substrate are provided. The developing device comprises: a conveying platform and a spraying mechanism disposed above the conveying platform; the spraying mechanism comprising a spraying pipe; a plurality of first nozzles and a plurality of second nozzles disposed on the spraying pipe. The conveying platform is used for conveying a substrate, and tilting the substrate with respect to the horizontal direction during a conveying process. The first nozzles are used for spraying a chemical solution onto the substrate continuously; the second nozzles are used for starting or ending spraying the chemical solution onto the substrate according to a predetermined spray density.

A method of manufacturing a glass film includes a forming step of forming a band-shaped glass film by pulling down a glass ribbon flowing down from a forming trough while sandwiching the glass ribbon from both front and back sides through use of roller pairs and a conveyance direction changing step of changing a conveyance direction of the glass film from the vertical direction to the horizontal direction by conveying the glass film along a conveyance path having an arc shape while supporting the glass film from a back surface side with a roller conveyor so that a front surface of the glass film after having passed through the conveyance path faces upward. A first roller to be brought into abutment against the glass film from the front surface side is arranged between a roller pair arranged in a lowermost stage and the roller conveyor.

A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed in a state where each of the plurality of substrates stand upright; a single-wafer processing section in which the plurality of substrates included in the wafer lot are processed one by one in a horizontal state; and an interface section that delivers the plurality of substrates from the batch processing section to the single-wafer processing section. The interface section includes: a standby table that horizontally holds a substrate in a state of being in contact with pure water; and a transfer mechanism that delivers the substrate from the batch processing section to the standby table.

Embodiments of the present disclosure generally relate to methods and apparatus for backside stress engineering of substrates to combat film stresses and bowing issues. In one embodiment, a method of depositing a film layer on a backside of a substrate is provided. The method includes flipping a substrate at a factory interface so that the backside of the substrate is facing up, and transferring the flipped substrate from the factory interface to a physical vapor deposition chamber to deposit a film layer on the backside of the substrate. In another embodiment, an apparatus for depositing a backside film layer on a backside of a substrate, which includes a substrate supporting surface configured to support the substrate at or near the periphery of the substrate supporting surface without contacting an active region on a front side of the substrate.

A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.