A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Embodiments of the present application provide an apparatus for carrying a substrate by an off-line vacuum suction and a method for transporting a substrate. The apparatus includes a carrying frame provided with a clamper, a vacuum suction device and a detaching device arranged on the carrying frame, wherein the vacuum suction device is arranged to suck and fix a substrate and is connectable to and detachable from a vacuum pipeline and the detaching device is arranged to detach the vacuum suction device and the vacuum pipeline from each other while keeping the vacuum suction device to continuously suck the substrate to be transported. The apparatus and the method can improve fixing of the substrate and achieve off-line suction to the substrate.

The component supply device includes a table on which a wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table. The pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up. The arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.

A component supply device which includes a moving slider for moving between a position near a wafer sheet replenishment section and a position near a mounter, a table supported on the moving slider, and a rotating mechanism for rotating the table around a specific rotation axis. The table is supported on the moving slider by a number one support point, a number two support point, and a number three support point which are provided on a circumference with the rotation axis at the center. The rotating mechanism includes a number one guide for moving number one support point in an arc with respect to the rotation axis, and driven guides for moving number two support point and number three support point in an arc with respect to the rotation axis.

A system for conveying a substrate includes a noncontact support platform for supporting the substrate. A vacuum wheel is located adjacent to the support platform. A rim of the vacuum wheel includes perforations that open between an exterior of the rim and an interior of the vacuum wheel. A fixed suction surface is interior to the vacuum wheel and includes an opening of a conduit that is connectable to a suction source. A chamber is formed by the suction surface, walls of the vacuum wheel, and a section of the peripheral rim that is adjacent to the suction surface and that extends outward from the support platform. When suction is applied to the conduit, the suction is applied via the chamber to the perforations in the rim section so as to exert a pull on the substrate toward the rim such that rotation of the vacuum wheel conveys the substrate.

A method of transferring light-emitting diodes including picking up the light-emitting diodes from a base substrate by using a first stamper; rotating the light-emitting diodes by about 90 degrees and arranging the light-emitting diodes over the first stamper or a sacrificial substrate; picking up the rotated light-emitting diodes arranged over the first stamper or the sacrificial substrate by using a second stamper; and releasing the light-emitting diodes from the second stamper towards a display substrate.

A processing method of processing a workpiece on which a plurality of intersecting planned dividing lines are set is provided. The processing method includes a holding step of holding the workpiece by a holding table, a dividing step of forming a plurality of chips by dividing the workpiece held by the holding table along the planned dividing lines, and a carrying-out step of, after the dividing step is performed, sucking the plurality of chips on the holding table by a suction unit including a suction head sucking the plurality of chips and a suction passage connected to the suction head, and carrying out the plurality of chips from the holding table via the suction passage.

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

A component conveying instrument comprising a first and second conveying instrument for conveying a component. The first conveying instrument is arranged to transfer the component to the second conveying instrument at a transfer location. The component conveying instrument further comprises an adjustment unit for adjusting one of the conveying instruments relative to the other conveying instrument along at least one or about at least one adjustment axis and an imaging unit. The imaging unit captures at least one image of the transfer location showing an end region of the first conveying instrument, and an end region of the second conveying instrument. The component conveying instrument also comprises an analyzing unit for analyzing the image, where the analyzing unit is coupled to the adjusting unit and is adapted to determine an asymmetry measure between the end region of the first conveying instrument and the end region of the second conveying instrument.

An apparatus for transporting a leadframe sheet during semiconductor die assembly includes a rail having sub-rails defining a machine track and an inner space along which the leadframe sheet is moved. A position detector senses a position of the leadframe sheet as the leadframe sheet moves along the machine track. A controller including a processor is coupled to the position detector for receiving the position of the leadframe sheet. A pressurized gas stopper is positioned within the inner space including a gas distributor having at least one gas inlet for receiving a pressured gas supply and at least one gas outlet for directing a flow of gas toward the leadframe sheet sufficient to stop movement of the leadframe sheet. The controller provides control signals for controlling the flow of gas to provide non-contact stopping of the leadframe sheet at one or more locations along the machine track.