An end effector for moving workpieces and replaceable parts within a system for processing workpieces. The end effector may include an arm portion extending between a first arm end and a second arm end along the axial direction. The end effector may further include a spatula portion extending between a first spatula end and a second spatula end, the first spatula end being adjacent the second arm end. Further, the end effector may include a first support member extending outwardly from the spatula portion, a second support member extending outwardly from the spatula portion, and a shared support member extending outwardly from the arm portion. The shared support member and the first support member together to support workpieces of a first diameter, and the shared support member and the second support member together support replaceable parts of a second diameter.

A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

In accordance with some embodiments herein, apparatuses for deposition of thin films are provided. In some embodiments, a plurality of stations is provided, in which each station provides a different reactant or combination of reactants. The stations can be in gas isolation from each other so as to minimize or prevent undesired chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) reactions between the different reactants or combinations of reactants.

A transfer path is provided which is extended so as to be passed on a lateral side of a processing portion that processes a substrate. The substrate transferred between a container held by a holding unit and the processing portion passes through the transfer path. A first transfer robot carries the substrate into and out of the container held by the holding unit, and accesses a reception/delivery region arranged within the transfer path. A second transfer robot receives and delivers the substrate from and to the first transfer robot in the reception/delivery region, and carries the substrate into and out of the processing portion. A second transfer robot raising/lowering unit which raises and lowers the second transfer robot is arranged within the transfer path. The reception/delivery region and the second transfer robot raising/lowering unit are located between the first transfer robot and the second transfer robot.

Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

The disclosure describes devices, systems, and methods for causing a factory interface of an electronic device manufacturing system to be moveable between a first position and a second position. An electronic device manufacturing system can include a transfer chamber, processing chambers connected to the transfer chamber, a load lock connected to the transfer chamber, and a factory interface connected to the load lock. The factory interface can be moveable between a first position and a second position. The factory interface, while oriented in the first position, is positioned for transfer of one or more substrates between the factory interface and the load lock, where at least one of the transfer chamber or the load lock are inaccessible for maintenance while the factory interface is oriented at the first position. The factory interface, while oriented in the second position, is positioned to provide maintenance access to at least one of the transfer chamber or the load lock. The factory interface can include one or more moveable components that cause the factory interface to be moveable between the first position and the second position.

A method includes receiving a plurality of operations in a sequence recipe. The plurality of operations are associated with processing a plurality of substrates in a substrate processing system. The method further includes identifying a plurality of completion times corresponding to the plurality of operations. Each completion time of the plurality of completion times corresponds to completion of a respective operation of the plurality of operations. The method further includes simulating the plurality of operations by setting a virtual time axis to each of the plurality of completion times to generate a schedule for the sequence recipe. The method further includes causing, based on the schedule, the plurality of substrates to be processed or performance of a corrective action.

A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.