Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.

According to an embodiment of the invention, there is provided a system, comprising: a first chamber; a second chamber; a chuck; a movement system; wherein the first chamber comprises: a first element that has a first surface; a first chamber housing that comprises a second surface; wherein the first surface and the second surface come into proximity with each other at a first interface; a supporting element for supporting the chuck when the chuck is positioned within the first chamber; and a first dynamic seal formed at the first interface and is arranged to seal the first chamber from the movement system; wherein the second chamber comprises: a second chamber housing; a movement system that is arranged to introduce movement between (a) the first chamber housing and (b) the first element and the chuck; and a movement control element for mechanically coupling the first element to the movement system.

Apparatus transfers a plate-shaped workpiece to/from a holding surface of a chuck table. The apparatus includes a holding unit and a moving mechanism. The holding unit includes at least two holding members for holding the outer edge of the workpiece, a support plate for supporting the holding members so as to allow movement of the holding members toward or away from the outer edge of the workpiece, and a moving unit for moving the holding members. Each holding member includes a rod portion vertically movably extending downward through the support plate, an engaging portion formed on the outer circumference of the rod portion at the lower end thereof for engaging the outer edge of the workpiece, and a nozzle portion for discharging a fluid from the lower surface of the rod portion toward the holding surface to thereby float the workpiece from the holding surface.

A substrate liquid treatment apparatus includes an inner tank configured to store a treatment liquid and having an upper opening, an outer tank disposed outside the inner tank, and a lid movable between a close position for closing the upper opening of the inner tank and an open position for opening the upper opening of the inner tank. The lid includes a main portion that covers the upper opening of the inner tank when the lid is positioned at the close position, and a splash shielding portion connected to the main portion. When the lid is positioned at the close position, the splash shielding portion extends from a position higher than an upper end of a side wall of the inner tank adjacent to the splash shielding portion to a position which is lower than the upper end of the side wall and which is on the outer tank side of the side wall.

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

An apparatus for cleaning semiconductor wafers includes a plurality of load ports; at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; and one or more single wafer cleaning modules. The apparatus further includes: a first turnover device, configured to rotate the one or more wafers from horizontal plane to vertical plane so that the one or more wafers can be vertically transferred to the at least one first tank; and a second turnover device, configured to rotate the one or more wafers from vertical plane to horizontal plane so that the one or more wafers can be horizontally transferred to the one or more single wafer cleaning modules.

A heat treatment method for a semiconductor substrate is provided which improves the shapes of the sharp corners at the opening and the bottom of a trench without using flammable or explosive gas while improving productivity. The heat treatment is performed on a semiconductor substrate with a recess formed therein in a treatment chamber where gas is sealed at a pressure exceeding a pressure in a molecular flow region.

In some embodiments, a system is provided that includes (1) a loading position; (2) a drying position; (3) a movable tank configured to (a) hold at least one substrate; (b) hold a cleaning chemistry so as to expose a substrate within the movable tank to the cleaning chemistry; and (c) translate between the loading position and the drying position; and (4) a drying station located at the drying position and configured to rinse and dry a substrate as the substrate is unloaded from the movable tank when the movable tank is at the drying position. Numerous other aspects are provided.

Provided is a substrate lift bar, including: an outer lift bar which is in shape of a box structure and includes one surface having an opening; an inner lift bar which is able to be accommodated in the outer lift bar and includes a supporting surface used for supporting a substrate; an elevator structure for controlling the inner lift bar to move up and down to change from a first state to a second state and back again; and an anti-static liquid smearing structure for smearing an anti-static liquid onto the inner lift bar if the inner lift bar is in the first state. In the first state, the inner lift bar is completely located inside the outer lift bar, and in the second state, the supporting surface of the inner lift bar is substantially flush with the surface having the opening of the outer lift bar.

A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).