In order to prevent breakage of a nut holder that holds a nut, a semiconductor apparatus includes a main terminal connected to an external conductor by a screw, a nut into which a tip of the screw is screwed, and a nut holder. The nut holder includes a recess holding the nut therein, and a peripheral wall surrounding the recess and having an opening. The peripheral wall is discontinuous at a position at which the opening is formed.

In order to prevent breakage of a nut holder that holds a nut, a semiconductor apparatus includes a main terminal connected to an external conductor by a screw, a nut into which a tip of the screw is screwed, and a nut holder. The nut holder includes a recess holding the nut therein, and a peripheral wall surrounding the recess and having an opening. The peripheral wall is discontinuous at a position at which the opening is formed.

A semiconductor apparatus includes a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an inclined face continuous to the lower face and positioned closer to a center of the base plate than the lower face, and fixed to the base plate through the adhesive agent adhering to the lower face and the inclined face, wherein of the adhesive agent, a portion that is in contact with the inclined face is thicker than a portion thereof that is in contact with the lower face.

A semiconductor apparatus includes a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an inclined face continuous to the lower face and positioned closer to a center of the base plate than the lower face, and fixed to the base plate through the adhesive agent adhering to the lower face and the inclined face, wherein of the adhesive agent, a portion that is in contact with the inclined face is thicker than a portion thereof that is in contact with the lower face.

A semiconductor device includes: a base plate having a first surface and having a first contact area in the first surface; a metal plate having a second surface, disposed such that the second surface faces the first surface, and having a second contact area in the second surface; a bonding material disposed between the first surface and the second surface and in contact with the first contact area and the second contact area to bond the metal plate and the base plate; an insulating plate disposed on the metal plate; a circuit member disposed on the insulating plate; a semiconductor element mounted to the circuit member; and a sealing material that covers the metal plate, the bonding material, the insulating plate, the circuit member, and the semiconductor element to seal a space above the base plate, wherein outside the second contact area, the second surface has a non-contact area that is not in contact with the bonding material, wherein on the base plate, a groove portion facing the non-contact area and surrounding the first contact area is provided, and wherein, in a plan view as viewed in a thickness direction of the base plate, an inner periphery of a corner portion of the groove portion has a first curve.

A semiconductor device includes: a base plate having a first surface and having a first contact area in the first surface; a metal plate having a second surface, disposed such that the second surface faces the first surface, and having a second contact area in the second surface; a bonding material disposed between the first surface and the second surface and in contact with the first contact area and the second contact area to bond the metal plate and the base plate; an insulating plate disposed on the metal plate; a circuit member disposed on the insulating plate; a semiconductor element mounted to the circuit member; and a sealing material that covers the metal plate, the bonding material, the insulating plate, the circuit member, and the semiconductor element to seal a space above the base plate, wherein outside the second contact area, the second surface has a non-contact area that is not in contact with the bonding material, wherein on the base plate, a groove portion facing the non-contact area and surrounding the first contact area is provided, and wherein, in a plan view as viewed in a thickness direction of the base plate, an inner periphery of a corner portion of the groove portion has a first curve.

Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.

A vehicle power conversion device includes: a housing configured to accommodate an electronic component therein and having an opening; and a cooling device. The cooling device includes a base being a plate-shaped member and heat sinks attached to the base. The base has a groove with refrigerant enclosed. The base has a first main surface to which the electronic component is to be attached, and covers the opening by the first main surface facing an interior of the housing. The heat sinks are joined, at intervals, onto the second main surface of the base.

A vehicle power conversion device includes: a housing configured to accommodate an electronic component therein and having an opening; and a cooling device. The cooling device includes a base being a plate-shaped member and heat sinks attached to the base. The base has a groove with refrigerant enclosed. The base has a first main surface to which the electronic component is to be attached, and covers the opening by the first main surface facing an interior of the housing. The heat sinks are joined, at intervals, onto the second main surface of the base.

An object is to provide a technique capable of increasing a heat radiation property in radiating a heat generated in a shunt resistance. A semiconductor device includes: a container body having a space with an opening; a semiconductor chip, a shunt resistance, and a circuit pattern disposed in the space in the container body; a partition member; a first cover; and a second cover. The partition member separates the space in the container body into a first space and a second space. The first cover covers a part of the opening corresponding to the first space, and the second cover covers a part of the opening corresponding to the second space. At least one hole through which the second space and outside of the container body are communicated with each other is formed in the second cover or by the second cover.