Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.

A semiconductor apparatus includes: a power semiconductor element; a control chip including a plurality of terminals including a first terminal and a second terminal, and being configured to control the power semiconductor element using a power supply voltage supplied to the second terminal; a first conductor for supplying a predetermined control voltage to the first terminal; a first line for supplying the power supply voltage to the second terminal; and semiconductor chip including a diode that is used for a bootstrap operation for generating the power supply voltage. The semiconductor chip includes: a semiconductor substrate: including a first face and a second face that are opposed to each other; and having a PN junction of the diode formed by a p-type semiconductor region on the first face and an n-type semiconductor region on the second face, an anode formed on the first face and joined to a surface of the first conductor, and a cathode formed on the second face and electrically connected to the second terminal via the first line.

A semiconductor apparatus includes: a power semiconductor element; a control chip including a plurality of terminals including a first terminal and a second terminal, and being configured to control the power semiconductor element using a power supply voltage supplied to the second terminal; a first conductor for supplying a predetermined control voltage to the first terminal; a first line for supplying the power supply voltage to the second terminal; and semiconductor chip including a diode that is used for a bootstrap operation for generating the power supply voltage. The semiconductor chip includes: a semiconductor substrate: including a first face and a second face that are opposed to each other; and having a PN junction of the diode formed by a p-type semiconductor region on the first face and an n-type semiconductor region on the second face, an anode formed on the first face and joined to a surface of the first conductor, and a cathode formed on the second face and electrically connected to the second terminal via the first line.

A power semiconductor device module includes a metal baseplate and a plastic housing that together form a tray. Power electronics are disposed in the tray. A plastic cap covers the tray. Electrical press-fit terminals are disposed along the periphery of the tray. Each electrical terminal has a press-fit pin portion that sticks up through a hole in the cap. In addition, the module includes four mechanical corner press-fit anchors disposed outside the tray. One end of each anchor is embedded into the housing. The other end is an upwardly extending press-fit pin portion. The module is manufactured and sold with the press-fit pin portions of the electrical terminals and the mechanical corner anchors unattached to any printed circuit board (PCB). The mechanical anchors help to secure the module to a printed circuit board. Due to the anchors, screws or bolts are not needed to hold the module to the PCB.

A power semiconductor device module includes a metal baseplate and a plastic housing that together form a tray. Power electronics are disposed in the tray. A plastic cap covers the tray. Electrical press-fit terminals are disposed along the periphery of the tray. Each electrical terminal has a press-fit pin portion that sticks up through a hole in the cap. In addition, the module includes four mechanical corner press-fit anchors disposed outside the tray. One end of each anchor is embedded into the housing. The other end is an upwardly extending press-fit pin portion. The module is manufactured and sold with the press-fit pin portions of the electrical terminals and the mechanical corner anchors unattached to any printed circuit board (PCB). The mechanical anchors help to secure the module to a printed circuit board. Due to the anchors, screws or bolts are not needed to hold the module to the PCB.

A power semiconductor device module includes a metal baseplate and a plastic housing that together form a tray. Power electronics are disposed in the tray. A plastic cap covers the tray. Electrical press-fit terminals are disposed along the periphery of the tray. Each electrical terminal has a press-fit pin portion that sticks up through a hole in the cap. In addition, the module includes four mechanical corner press-fit anchors disposed outside the tray. One end of each anchor is embedded into the housing. The other end is an upwardly extending press-fit pin portion. The module is manufactured and sold with the press-fit pin portions of the electrical terminals and the mechanical corner anchors unattached to any printed circuit board (PCB). The mechanical anchors help to secure the module to a printed circuit board. Due to the anchors, screws or bolts are not needed to hold the module to the PCB.

A power semiconductor device module includes a metal baseplate and a plastic housing that together form a tray. Power electronics are disposed in the tray. A plastic cap covers the tray. Electrical press-fit terminals are disposed along the periphery of the tray. Each electrical terminal has a press-fit pin portion that sticks up through a hole in the cap. In addition, the module includes four mechanical corner press-fit anchors disposed outside the tray. One end of each anchor is embedded into the housing. The other end is an upwardly extending press-fit pin portion. The module is manufactured and sold with the press-fit pin portions of the electrical terminals and the mechanical corner anchors unattached to any printed circuit board (PCB). The mechanical anchors help to secure the module to a printed circuit board. Due to the anchors, screws or bolts are not needed to hold the module to the PCB.

A semiconductor module includes a rectangular base plate; a substrate which is placed on the base plate and on which a circuit including a semiconductor chip and so forth is formed; a rectangular parallelepiped case made of resin that is attached to the base plate and houses the substrate within; and a plurality of external terminals lower ends of which are fixed to the substrate with upper ends thereof being exposed on a top face of the case. The case is provided with a first case opening portion and a second case opening portion that are respectively formed by cutting off a front face and a rear face of the case from an upper edge thereof along a longitudinal direction thereof; and the top face of the case between the first case opening portion and the second case opening portion includes an external terminal holding portion to hold the plurality of external terminals along the longitudinal direction with the upper ends thereof being exposed. A sealing material is injected from the first case opening portion and the second case opening portion onto a top face of the substrate, and thereby the semiconductor module is sealed.

A semiconductor module includes a rectangular base plate; a substrate which is placed on the base plate and on which a circuit including a semiconductor chip and so forth is formed; a rectangular parallelepiped case made of resin that is attached to the base plate and houses the substrate within; and a plurality of external terminals lower ends of which are fixed to the substrate with upper ends thereof being exposed on a top face of the case. The case is provided with a first case opening portion and a second case opening portion that are respectively formed by cutting off a front face and a rear face of the case from an upper edge thereof along a longitudinal direction thereof; and the top face of the case between the first case opening portion and the second case opening portion includes an external terminal holding portion to hold the plurality of external terminals along the longitudinal direction with the upper ends thereof being exposed. A sealing material is injected from the first case opening portion and the second case opening portion onto a top face of the substrate, and thereby the semiconductor module is sealed.

A method for packaging a circuit component, comprising: forming a first protruding pad on a first copper substrate and a through-hole in the first protruding pad; forming a second protruding pad on a second copper substrate and placing a circuit dice of the circuit component on the second protruding pad having a conductive paste coated thereon wherein a first electrode of the dice facing the second protruding pad; stacking the first copper substrate onto the second copper substrate with the first protruding pad having a conductive paste coated thereon aligned and pressing onto the circuit dice placed on the second protruding pad wherein a second electrode of the dice facing the first protruding pad; inserting a copper rod tightly into the through-hole until contacting with a conductive paste coated on the second substrate; heat-treating the stacked structure for the circuit dice and the copper rod to form secured electrical connection with the first and second copper substrates respectively and further forming a hermetic seal in the space between the first and second copper substrates; and using the hermetic seal as a rigid processing structure, etching the exposed surface of the first and second copper substrates to remove the entire thickness of copper other than in the area of the first and second protruding pads and in the area other than where the copper rod connects to the second copper substrate, thereby forming the device terminals of the circuit component package.