A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin.

Failure analysis and recycle of a semiconductor device are facilitated, and a production efficiency of the semiconductor device is improved. An exterior includes an inner space and an inner surface surrounding the inner space. A semiconductor chip is housed in the inner space and mounted on the inner surface. A first sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, and is made up of silicone gel. A waterproof water-repellent layer is housed in the inner space, disposed on the inner surface to be overlapped on the semiconductor chip and the first sealing material, and made up of fluorine-series resin or silicone-series resin. A second sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, the first sealing material, and the waterproof water-repellent layer, and is made up of silicone gel.

Failure analysis and recycle of a semiconductor device are facilitated, and a production efficiency of the semiconductor device is improved. An exterior includes an inner space and an inner surface surrounding the inner space. A semiconductor chip is housed in the inner space and mounted on the inner surface. A first sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, and is made up of silicone gel. A waterproof water-repellent layer is housed in the inner space, disposed on the inner surface to be overlapped on the semiconductor chip and the first sealing material, and made up of fluorine-series resin or silicone-series resin. A second sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, the first sealing material, and the waterproof water-repellent layer, and is made up of silicone gel.

A semiconductor module arrangement includes an input stage including a first output terminal and a second output terminal, wherein a first inductive element is coupled to the first output terminal; an output stage including at least one first controllable semiconductor element, a third input terminal coupled to the first inductive element such that the first inductive element is coupled between the first output terminal and the third input terminal, a fourth input terminal coupled to the second output terminal, a third output terminal, and a fourth output terminal; a second controllable semiconductor element and a first capacitive element coupled in series and between a first common node coupled between the first inductive element and the third input terminal, and a second common node coupled between the second output terminal and the fourth input terminal; and a first diode element coupled in parallel to the second controllable semiconductor element.

A semiconductor module includes a semiconductor element, a substrate on which the semiconductor module is mounted, a heat radiating plate on which the substrate is mounted, a resin case, and a first main current electrode and a second main current electrode, in which in the first main current electrode and the second main current electrode, one end of each thereof is joined to a circuit pattern on the substrate, an other end of each thereof is extended through and incorporated in a side wall of the resin case so as to project outward of the resin case, and each thereof has at least a portion of overlap at which a part thereof overlaps in parallel with each other with a gap therebetween, and each thereof has a slope portion provided between an external projection portion and an internal projection portion.

A semiconductor module includes a semiconductor element, a substrate on which the semiconductor module is mounted, a heat radiating plate on which the substrate is mounted, a resin case, and a first main current electrode and a second main current electrode, in which in the first main current electrode and the second main current electrode, one end of each thereof is joined to a circuit pattern on the substrate, an other end of each thereof is extended through and incorporated in a side wall of the resin case so as to project outward of the resin case, and each thereof has at least a portion of overlap at which a part thereof overlaps in parallel with each other with a gap therebetween, and each thereof has a slope portion provided between an external projection portion and an internal projection portion.

A spectroscopic sensor includes a wiring substrate having a main surface, a light detector disposed on the main surface of the wiring substrate, a Fabry-Perot interference filter, a spacer which is provided on the main surface of the wiring substrate and supports the Fabry-Perot interference filter so that the Fabry-Perot interference filter and the light detector are separated from each other, and a stein connected to a ground potential. A second current path which has a smaller electric resistance than that of an arbitrary first current path which extends from the Fabry-Perot interference filter to the light detector via the spacer and the wiring substrate is formed between the Fabry-Perot interference filter and the stein.

A method for producing a power semiconductor module arrangement includes: arranging a semiconductor substrate in a housing, the housing including a through hole extending through a component of the housing; inserting a pin or bolt into the through hole such that an upper end of the pin/bolt is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a heat sink having a hole, the housing being arranged on the heat sink such that the through hole is aligned with the hole in the heat sink; and by way of a first pressing tool, exerting a force on a defined contact area of the printed circuit board and pressing the pin/bolt into the hole in the heat sink, wherein the defined contact area is arranged directly above the pin/bolt.

A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.

A chip package and method for fabricating the same are provided which utilize a cover having one or more windows formed through one or more sidewalls to provide excellent resistance to warpage while allowing access to an internal volume of the chip package. In one example, the chip package includes a package substrate, an integrated circuit (IC) die, and a cover disposed over the IC die. The cover includes a lower surface facing the IC die, an upper surface facing away from the IC die, a lip extending from the lower surface, and a first sidewall extending from a first edge of the upper surface to the bottom of the lip. The lip is secured to the package substrate and encloses a volume between the lower surface and the package substrate. The IC die resides in the volume. A first elongated window is formed through the first sidewall and exposes the volume through the cover.