A package assembly includes a package substrate, a package lid located on the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot having a height greater than or equal to a height of the outer foot, extending from the plate portion and including a first inner foot corner portion located inside a first corner of the outer foot, and an adhesive that adheres the outer foot to the package substrate and adheres the inner foot to the package substrate.

A package assembly includes a package substrate, a package lid located on the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot having a height greater than or equal to a height of the outer foot, extending from the plate portion and including a first inner foot corner portion located inside a first corner of the outer foot, and an adhesive that adheres the outer foot to the package substrate and adheres the inner foot to the package substrate.

An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.

A package has a package body formed by stacked insulating layers and having a front surface including a mounting area, a back surface and a side surface; a plurality of hollow portions arranged so as to be adjacent to each other on the front surface of the package body; a plurality of electrode pads individually placed on respective bottom surfaces of the hollow portions; and a partition wall formed by at least one insulating layer that forms the package body and having protruding banks at its both edge sides. Surfaces of the electrode pads are located at a lower position with respect to the front surface of the package body. The hollow portions are arranged at opposite sides of the partition wall. The electrode pads are electrically connected to respective conductor layers that are formed on the back surface and/or the side surface of the package body.

A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.

A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.

An electronic component housing package includes: an insulating substrate including a main surface; an external connection conductor including a portion exposed at the main surface; and an inner layer conductor located inside of the external connection conductor in a thickness direction of the insulating substrate, in which the external connection conductor includes a protruding portion extending toward the inner layer conductor, and the protruding portion is in contact with the inner layer conductor.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.