A power semiconductor module arrangement includes: a housing; first and second electrical contacts within the housing; and a mounting arrangement including a frame or body and first and second terminal elements. The mounting arrangement is inserted in and coupled to the housing. First ends of the first and second terminal elements mechanically and electrically contact the first and second electrical contacts, respectively. A middle part of each terminal element extends through the frame or body. A second end of each terminal element extends outside the housing. The first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body. The first terminal element is injected into and inextricably coupled to the frame or body. The second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body.

A power semiconductor module arrangement includes: a housing; first and second electrical contacts within the housing; and a mounting arrangement including a frame or body and first and second terminal elements. The mounting arrangement is inserted in and coupled to the housing. First ends of the first and second terminal elements mechanically and electrically contact the first and second electrical contacts, respectively. A middle part of each terminal element extends through the frame or body. A second end of each terminal element extends outside the housing. The first terminal element is dielectrically insulated from the second terminal element by a portion of the frame or body. The first terminal element is injected into and inextricably coupled to the frame or body. The second terminal element is arranged within a hollow space inside the frame or body and is detachably coupled to the frame or body.

A semiconductor device comprises a lead, a board, and an electrically conductive layer on the board. The lead comprises a longitudinal axis and is soldered to the electrically conductive layer. The semiconductor device further comprises a first solder dam edge and a second solder dam edge, each positioned on the lead not more than 10 mils apart from each other along the longitudinal axis.

A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and at least two external contacts made of a metal or an alloy and arranged next to each other, which are electrically and mechanically connected to the first side of the first chip carrier and protrude laterally out of the encapsulation body. At least one of the external contacts has at least one wing arranged within the encapsulation body and located opposite the other external contact. The wing includes one or more cutouts that are filled with the encapsulation material of the encapsulation body.

A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and at least two external contacts made of a metal or an alloy and arranged next to each other, which are electrically and mechanically connected to the first side of the first chip carrier and protrude laterally out of the encapsulation body. At least one of the external contacts has at least one wing arranged within the encapsulation body and located opposite the other external contact. The wing includes one or more cutouts that are filled with the encapsulation material of the encapsulation body.

An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.

An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.

A semiconductor apparatus includes: a first semiconductor chip; a resin enclosure having a space in which the first semiconductor chip is positioned; a lead terminal disposed in the resin enclosure; a second semiconductor chip configured to: control the first semiconductor chip, and be disposed on a first portion of the resin enclosure, the resin enclosure not overlapping with the lead terminal, as seen in planar view from a direction perpendicular to a top surface of the lead terminal; and a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip.

A semiconductor apparatus includes: a first semiconductor chip; a resin enclosure having a space in which the first semiconductor chip is positioned; a lead terminal disposed in the resin enclosure; a second semiconductor chip configured to: control the first semiconductor chip, and be disposed on a first portion of the resin enclosure, the resin enclosure not overlapping with the lead terminal, as seen in planar view from a direction perpendicular to a top surface of the lead terminal; and a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip.

A medical device including a hybrid circuitry assembly, a core assembly housing having an inside surface, and a tag/getter assembly. The core assembly housing to enclose the hybrid circuitry assembly, and the tag/getter assembly to be situated adjacent the inside surface of the core assembly housing. The tag/getter assembly including an identification tag and a hydrogen getter.