Method of manufacturing a photovoltaic module comprising at least a first layer and a second layer affixed to each other by means of an encapsulant, said method comprising a lamination step wherein the encapsulant material comprises a silane-modified polyolefin having a melting point below 90° C., pigment particles and an additive comprising a cross-linking catalyst; and wherein in said lamination step heat and pressure are applied to the module, said heat being applied at a temperature between 60° C. and 125° C.

A novel polymer containing silphenylene and polyether structures in the backbone is used to formulate a photosensitive composition having improved reliability.

The present disclosure provides nanocrystals(s) containing silicone capping agent(s). Dispersions containing the nanocrystal(s) and at least one of silicone monomer(s), silicone pre-polymer(s), and silicone polymer(s), and optionally additionally containing a solvent are also described. Cured dispersions, compositions of nanocrystal(s) and LEDs and related structures containing the composition(s) are provided in the present disclosure.

The present invention relates to silazane-siloxane random copolymers as well as their production and their uses, particularly in LEDs.

Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate, and a plurality of press-fit pins. The plurality of press-fit pins may be fixedly coupled with the case. The plurality of press-fit pins may have at least one locking portion that extends from a side of the plurality of press-fit pins into the case and the plurality of press-fit pins may be electrically and mechanically coupled to the substrate.

A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements is disclosed. The composition comprises: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, optionally, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.

Various embodiments disclosed relate to semiconductor device and method of making the same using functional silanes. In various embodiments, the present invention provides a semiconductor device including a silicon die component having a first silica surface. The semiconductor device includes a dielectric layer having a second surface generally facing the first silica surface. The semiconductor device includes an interface defined between the first surface and the second surface. The semiconductor device also includes a silane based adhesion promoter layer disposed within the junction and bonded to at least one of the first silica surface and the dielectric layer second surface.

An epoxy resin composition includes an epoxy resin; a curing agent; alumina particles; and a silane compound which does not have a functional group that is reactive with an epoxy group and which has a functional group that is unreactive with an epoxy group, wherein the silane compound has a structure in which the functional group that is unreactive with an epoxy resin is bound to a silicon atom, or is bound to a silicon atom via a chain hydrocarbon group having 1 to 5 carbon atoms.

Provided is a silicone gel composition containing, as essential components: (A) an organopolysiloxane containing an alkenyl group bonded to two or more silicon atoms in one molecule, the organopolysiloxane comprising (a-1) a branched organopolysiloxane having an alkenyl group bonded to three or more silicon atoms only at an end of a molecular chain in one predetermined molecule, and (a-2) a linear organopolysiloxane having an alkenyl group bonded to two or more silicon atoms only at both ends of a molecular chain in one predetermined molecule; (B) a linear organohydrogenpolysiloxane containing hydrogen atoms bonded to two or more silicon atoms in one predetermined molecule; and (C) a platinum-based curing catalyst.

Curing the silicone gel can provide a silicone gel cured product which has a degree of penetration of 40-100 as defined according to JIS K2220, has a free oil content of 15 mass % or less, has a low modulus and low stress, and does not exhibit oil bleeding over time.

An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts. (A): A polyorganosiloxane represented by average unit formula: (SiO.sub.4/2).sub.a1(R.sup.1SiO.sub.3/2).sub.a2(R.sup.1.sub.2SiO.sub.2/2).sub.a3(R.sup.1.sub.3SiO.sub.1/2).sub.a4 R.sup.1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R.sup.1; and a1>0, a2>0, a30, a4>0, 0.01a1/a210, and a1+a2+a3+a4=1. (B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %. (C): An organopolysiloxane represented by average unit formula below: (R.sup.xSiO.sub.3/2).sub.x1(R.sup.x.sub.2SiO.sub.2/2).sub.x2(R.sup.x.sub.2SiR.sup.AR.sup.x.sub.2SiO.sub.2/2).sub.x3(R.sup.x.sub.3SiO.sub.1/2).sub.x4 where R.sup.x is alkyl, aryl, alkenyl, or the like; a proportion of the aryl relative to a total amount of R.sup.x is from 1 to 50 mol %, and at least two of all the R.sup.x moieties are alkenyl; R.sup.A is a divalent hydrocarbon group; and 0.05>x10, x2+x3>0, x4>0, and x1+x2+x3+x4=1. (D) A polyorganosiloxane represented by average composition formula below:
R.sup.2.sub.mH.sub.nSiO.sub.[(4-m-n)/2] where R.sup.2 is alkyl or aryl, and at least two silicon atoms are bonded to hydrogen atoms; and 0.7m2.1, 0.001n1, and 0.8m+n3. (E): A hydrosilylation catalyst.