A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

A thermal packaging device for dissipating heat generated by electronic components comprising a copper base and a ceramic frame mounted to the base with a buffer comprising a nickel-cobalt ferrous alloy. Also disclosed is a thermal packaging device with a base comprised of a layer of copper molybdenum alloy sandwiched between two layers of copper and a ceramic frame mounted to the base. Further disclosed is a thermal packaging device with a base comprised of alternating layers of copper, molybdenum, and copper; and a ceramic frame mounted to the base.

A thermally conductive sheet precursor according to an embodiment of the present disclosure includes agglomerates in which anisotropic thermally conductive primary particles are agglomerated, an isotropic thermally conductive material different from the agglomerates and having an average particle diameter of about 20 μm or greater, and a binder resin. When a first pressure in a range from about 0.75 to about 12 MPa is applied to the thermally conductive sheet precursor, at least some the agglomerates disintegrate.

A mounting device for mounting electronic components, wherein the mounting device comprises a stack, in particular a layer stack configured as alternating sequence of at least one support structure for providing mechanical support and a plurality of thermally conductive and electrically insulating structures.

A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first stack of layers and the second stack of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.

Stacked semiconductor die assemblies with thermal spacers and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a thermally conductive casing defining a cavity, a stack of first semiconductor dies within the cavity, and a second semiconductor die stacked relative to the stack of first dies and carried by a package substrate. The semiconductor die assembly further includes a thermal spacer disposed between the package substrate and the thermally conductive casing. The thermal spacer can include a semiconductor substrate and plurality of conductive vias extending through the semiconductor substrate and electrically coupled to the stack of first semiconductor dies, the second semiconductor die, and the package substrate.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

According to various aspects, a thermal-aware finned field-effect transistor (FinFET) may have a design that can substantially reduce hot spot temperatures and resolve other self-heating problems. More particularly, the FinFET design may use aluminum nitride (AlN) fins that can provide a main thermal exit and a source, drain, and channel formed from materials that can spread or dissipate heat, wherein AlN has a high thermal conductivity compared to silicon such that using AlN to form the fins may substantially increase heat flux to a silicon substrate relative to silicon fins. Furthermore, thermal-efficient materials may be used to form the source, drain, and channel structures to further spread heat and decrease hot spot temperatures.

To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

A thermally conductive sheet has a high thermal conductivity and superior heat resistance. The thermally conductive sheet includes a rubber having flowability and a thermally conductive filler. The rubber is loaded with the thermally conductive filler and mixed and kneaded to form the thermally conductive sheet, and the thermally conductive filler includes a small particulate filler having an average particle size of not greater than 10 μm. The thermally conductive sheet has a thermal conductivity of not less than 1 W/m.Math.K and an Asker C hardness after heating of not greater than 60.