An electrical assembly includes an electrical connector mounted upon the PCB to receive a CPU therein. A securing seat is fixed on the PCB with four upwardly extending posts. A heat sink is secured to the posts by the screw nuts and seated upon the CPU. A auxiliary retention piece is located upon the securing seat around one post so as to prevent the CPU from excessively tilting due to the screw nut fastening occurring on an opposite diagonal corner.

Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.

Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.

An electrical assembly includes an electrical connector mounted upon the PCB to receive a CPU therein. A securing seat is fixed on the PCB with four upwardly extending posts. A heat sink is secured to the posts by the screw nuts and seated upon the CPU. A auxiliary retention piece is located upon the securing seat around one post so as to prevent the CPU from excessively tilting due to the screw nut fastening occurring on an opposite diagonal corner.

A plate-shaped conductor is placed on an upper surface of a plate-shaped heat dissipation member with an insulation member interposed therebetween. A heat insulation member is placed at a location that is different from a location where the conductor is placed, on the upper surface of the heat dissipation member. An FET is electrically connected to the conductor. When current flows through the FET, the FET generates heat. A microcomputer that outputs a control signal for controlling operation of the FET is connected to an upper surface of the circuit board and is located opposite to the heat insulation member with the circuit board interposed therebetween.

A heat sink for a semiconductor switching device. The heat sink has a contact surface for producing planar contact with one or more elements of a power module of the semiconductor switching device that are to be cooled. The heat sink additionally has measures for positioning the power module on and fastening it to the heat sink in a preferred position, and a fastening plate with molded-on mountings for positioning and mounting the heat sink on a carrier device. The heat sink, including the contact surface and the fastening plate, is manufactured in one piece from electrically insulating, thermally conductive plastics material having a thermal conductivity of at least 2 W/(m.Math.K).

Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.