A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.

Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.

A power electronics module includes a glass layer with one or more vias extending through the glass layer and having an electrically and thermally conductive material disposed within the one or more vias, a power electronic device directly bonded to a first surface of the glass layer, and, a cooling structure thermally coupled to a second surface of the glass layer.

A power semiconductor module arrangement includes a power semiconductor module, wherein the power semiconductor module includes a substrate for carrying at least one semiconductor body, and a heat-conducting layer arranged on a lower surface of the power semiconductor module, wherein the lower surface of the power semiconductor module is a surface that is configured to be mounted to a heat sink, and wherein the heat-conducting layer consists of a metallic and non-eutectic material that is solid at temperatures below a first threshold temperature, that is viscous at temperatures above the first threshold temperature and below a second threshold temperature, and that is fluid at temperatures above the second threshold temperature.

A heat dissipation structure assembly includes an elastic limiting member, a thermal grease wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The thermal grease wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the thermal grease wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the thermal grease wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the thermal grease wall.

A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

A thermal management system for a computing device includes an immersion tank with a cooling fluid therein, a computing device positioned in the cooling fluid in the immersion tank, and a thermal block positioned in the cooling fluid in the immersion tank. The computing device heats the cooling fluid, and the thermal block is configured to receive heat from the cooling fluid. The thermal block includes a fluid management feature to direct flow of the cooling fluid relative to the thermal block and computing device.

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

A cooling device comprises a first casing for direct mounting on a heat-generating component and a second casing mounted on the first casing. One casing includes an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel. The other casing includes a storage containing a phase change material (PCM) changing from a solid state to a liquid state to transfer thermal energy from the heat-generating unit to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid. The cooling device may be integrated in a cooling circuit of a cooling system including an external cooling unit, or in a closed loop cooling circuit of a cooling arrangement that transfers heat from the closed loop to an open loop.