A thermally conductive insulator includes a first part having first fins arranged on a surface of the first part, and a second part having second fins arranged on a surface of the second part. The first fins and the second fins are arranged in such a way that they mesh with one another. Arranged between the first and second parts in a region of the first and second fins is an insulating layer.

In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C.sub.2H.sub.4—R—C(O)OH and an ethylene glycol monomer having a chemical formula C.sub.2nH.sub.4n+2O.sub.n+1.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.

A resin composition contains a polymer whose enthalpy of fusion (ΔH) observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J/g or more; and a low-molecular-weight compound whose enthalpy of fusion (ΔH) observed within a temperature range of 0° C. or higher and lower than 100° C. in differential scanning calorimetry is 30 J/g or more and whose molecular weight is 2000 or lower. A content of the low-molecular-weight compound is 3 parts by weight to 1000 parts by weight with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition except the low-molecular-weight compound.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.

Embodiments herein relate to systems, techniques, and/or processes directed to a composite thermal matrix structure to provide thermal conductivity within a package. The composite thermal matrix may include a first material that is substantially solid and a second material that is liquid and absorbed into the first material. A package may include the composite thermal matrix within an integrated heat sink coupled with a printed circuit board and encapsulating one or more die where the thermal matrix structure is in a state of compressive stress within the heat sink. The thermal matrix structure may expand and contract as the heat sink warps during thermal cycling to maintain constant thermal conductivity with low stress on the package.

Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer.

A heat removal system comprising a heat sink, a plurality of fractal-fins each having a predetermined geometry; and a plurality of phase change materials each having a predetermined geometry.