An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.

Provided is a power converter which is applied to a power converter equipped with a switching element provided on a line, and a radiator connected to a predetermined potential such as a ground potential. A noise eliminator in which a conductive member is covered with insulator is provided between the switching element (semiconductor switch) and the radiator (heatsink). A flexible connecting line connected to a conductive member of the noise eliminator is connected to an on-board line disposed on a circuit board.

A system including at least one heat-generating structure and a cooling system is described. The cooling system includes a cooling element and an exhaust system. The cooling element is in communication with a fluid and is configured to direct the fluid toward the heat-generating structure(s) using vibrational motion. The exhaust system is configured to direct fluid away from the heat-generating structure to extract the heat and/or to draw the fluid toward the cooling element.

A heat transfer system includes a heat source, a first heat exchanger coupled to the heat source to remove heat from the heat source, and a second heat exchanger coupled to the first heat exchanger to remove heat from the first heat exchanger. The heat transfer system also includes a thermal doubler coupled to the second heat exchanger to remove heat from the second heat exchanger, a first heat pipe coupled to the thermal doubler to remove heat from the thermal doubler, and a second heat pipe coupled to the first heat pipe to remove heat from the first heat pipe.

A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.

A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.

Provided is a power converter which is applied to a power converter equipped with a switching element provided on a line, and a radiator connected to a predetermined potential such as a ground potential. A noise eliminator in which a conductive member is covered with insulator is provided between the switching element (semiconductor switch) and the radiator (heatsink). A flexible connecting line connected to a conductive member of the noise eliminator is connected to an on-board line disposed on a circuit board.

A pressure relief valve for a two-phase immersion cooling system is configured to support fluid flow rates up to 500 cfm, 550 cfm, 600 cfm, or even 2000 cfm. This, in turn, allows the cooling system to support computing systems with a power density greater than 250 kW. This is accomplished by the valve having a relatively large passage (e.g., 2-6 inch diameter), a relatively large spring (e.g., 1.5-1.7 inch diameter), and a guide rod rigidly coupled to the poppet and slidably coupled to a guide plate. The valve may be used as an outlet valve and coupled to an adsorbent chamber to reduce the loss of coolant from the system as air is vented to an ambient environment. The valve may be used as an inlet valve and coupled to an adsorbent chamber to reduce the intake of water vapor as air from the ambient environment flows into the system.

Thermal management devices, systems, and methods of fabrication thereof are generally directed to accommodating variability in height, shape, or other geometric features of one or more heat-dissipating components on a substrate while maintaining efficient transfer of heat away from the one or more heat-dissipating components. For example, a thermal management device may include a housing, a diaphragm, and a wick, the wick disposed along a chamber defined by the housing and the diaphragm such that a fluid within the chamber may evaporate and condense along the chamber to transfer heat away from one or more heat-dissipating components (e.g., electronic components or photonics). The diaphragm may be resiliently flexible relative to the housing to bias a contact surface of the diaphragm against one or more heat-dissipating components while maintaining efficient transfer of heat through the chamber and away from the one or more heat-dissipating components.

A vapor chamber structure includes a plate-shaped shell and at least one stretchable heated member. The plate-shaped shell has a hollow interior to form a cavity and has a base on which at least one throughhole is disposed. The throughhole communicates with the cavity. The stretchable heated member is disposed on the base of the plate-shaped shell. The stretchable heated member includes a heated plate and a hollow stretchable tube. The heated plate is sealedly connected to one end of the stretchable tube and the throughhole of the plate-shaped shell is sealedly connected to the other end of the stretchable tube.