An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

A cooling device configured to be mounted in close proximity to an electronic component that is to be cooled is provided. In one aspect, the device includes impingement channels and return channels for guiding a flow of cooling fluid towards and away from a cooled surface of the electronic component. The device also includes a heat exchanger and a pump, so that the flow cycle of a cooling fluid is fully confined within the device itself. The impingement channels, the return channels, and the heat exchanger are integrated in a common housing, which includes an inlet opening and an outlet opening for coupling the device to a refrigerant loop. The pump may be a micropump mounted directly on the housing and coupled to the inlet and outlet openings in the housing. A cooling system including the device and the refrigerant loop is also provided.

A three-dimensional integrated circuit cooling system is provided for removing heat from a three-dimensional integrated circuit. Plural fluid microchannels are formed among plural middle chip layers and a main chip layer of the three-dimensional integrated circuit. The three-dimensional integrated circuit cooling system comprises a base and a fluid pump. The base has an introduction opening, a discharge opening and a fluid passage. The fluid pump is fixed on the base and seals the edge of the introduction opening. When the fluid pump is enabled, an ambient fluid is driven by the fluid pump, introduced into the fluid passage through the introduction opening, and discharged through the discharge opening. The discharged fluid passes along every fluid microchannel of the three-dimensional integrated circuit as flowing through the plural middle chip layers and the main chip layer so as to perform heat exchange therewith.

An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a supporting substrate, an air pump and a heat sink. The supporting substrate includes a top surface, a bottom surface, an introduction opening and a thermal conduction plate. The thermal conduction plate is located over the top surface of the supporting substrate and aligned with the introduction opening. The electronic component is disposed on the thermal conduction plate. The air pump is fixed on the bottom surface of the supporting substrate and aligned with the introduction opening. The heat sink is attached on the electronic component. When the air pump is enabled, an ambient air is introduced into the introduction opening to remove the heat from the thermal conduction plate.

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

A system including at least one heat-generating structure and a cooling system is described. The cooling system includes a cooling element and an exhaust system. The cooling element is in communication with a fluid and is configured to direct the fluid toward the heat-generating structure(s) using vibrational motion. The exhaust system is configured to direct fluid away from the heat-generating structure to extract the heat and/or to draw the fluid toward the cooling element.

A cooling structure includes a first substrate layer including an array of cooling channels, a second substrate layer including a nozzle structure, an outlet manifold, and an outlet, a third substrate layer including an inlet, and inlet manifold, and one or more flow directing features are disposed within the inlet manifold. The one or more flow directing features include one or more micro-pillars extending into the cooling fluid flow path from the inlet manifold, the first substrate layer includes one or more first substrate layer through-holes, the second substrate layer includes one or more second substrate layer-through holes, and the third substrate layer includes one or more third-substrate layer through holes. The first substrate layer through-holes, the second substrate layer through-holes, and the third substrate layer through-holes are aligned into one or more TSVs and metallized.

A cooler includes: a fin having a coolant inflow port; and a nozzle configured to eject the supplied coolant toward the coolant inflow port. The nozzle includes a flow passage wall, a tip end, a pressure receiving portion and a deformation portion. The tip end provides a coolant supply hole that ejects the coolant flowing through the flow passage. The pressure receiving portion is configured to be provided between the flow passage wall and the coolant supply hole, and to receive force in an ejection direction of the coolant. The deformation portion is configured to be provided either of between the flow passage wall and the pressure receiving portion and in the pressure receiving portion, and to displace the coolant supply hole in the ejection direction of the coolant in response to the force in the ejection direction of the coolant, the force being received by the pressure receiving portion.

A system and method for reducing or increasing the mechanical structure resonance of a synthetic jet device is disclosed. A synthetic jet device includes a first plate, a second plate spaced apart from the first plate, a spacing component coupled to and positioned between the first and second plates to form a chamber and including an orifice therein, and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof, thereby changing a volume within the chamber so that a series of fluid vortices is generated and projected out from the orifice of the spacing component. At least one of the first and second plates includes a modified section that alters a mechanical resonance of the synthetic jet device, so as to control a level of acoustic noise generated by the synthetic jet device.

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins. Other embodiments of the invention are directed to heat spreaders (e.g. heat pipes or vapor chambers) that provide enhanced thermal management via enhanced wicking structures and/or vapor creation and flow structures. Other embodiments provide enhanced methods for making such arrays and spreaders.