An electronics assembly in which microjet nozzles are co-located with electronic elements on the same substrate or layer. This technique may be used to integrate lower power-density electronics onto an existing microjet nozzle plate to perform microjet nozzle cooling, which removes the need for separate thermal management solutions for systems that contain both high and lower power-density elements in proximity. This technique may also be used in multilayered 3D integrated electronic substrates, allowing for thin, high performing thermal management solutions in 3D integrated stackups using microjets.

A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.

A three-dimensional integrated circuit cooling system is provided for removing heat from a three-dimensional integrated circuit. Plural fluid microchannels are formed among plural middle chip layers and a main chip layer of the three-dimensional integrated circuit. The three-dimensional integrated circuit cooling system comprises a base and a fluid pump. The base has an introduction opening, a discharge opening and a fluid passage. The fluid pump is fixed on the base and seals the edge of the introduction opening. When the fluid pump is enabled, an ambient fluid is driven by the fluid pump, introduced into the fluid passage through the introduction. opening, and discharged through the discharge opening. The discharged fluid passes along every fluid microchannel of the three-dimensional integrated circuit as flowing through the plural middle chip layers and the main chip layer so as to perforin heat exchange therewith.

An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a supporting substrate, an air pump and a heat sink. The supporting substrate includes a top surface, a bottom surface, an introduction opening and a thermal conduction plate. The thermal conduction plate is located over the top surface of the supporting substrate and aligned with the introduction opening. The electronic component is disposed on the thermal conduction plate. The air pump is fixed on the bottom surface of the supporting substrate and aligned with the introduction opening. The heat sink is attached on the electronic component. When the air pump is enabled, an ambient air is introduced into the introduction opening to remove the heat from the thermal conduction plate.

An assembly of synthetic jet devices is provided for cooling a heat sink. The assembly includes a mounting member for coupling to a heat sink including a plurality of fins, and a plurality of synthetic jet devices. Each of the plurality of synthetic jet devices includes an actuation module having a first actuator and a first plate opposite a second actuator and a second plate, and an extension module operably coupling the actuation module to the mounting member. Each actuation module of a synthetic jet device is configured to be suspended within a channel between two fins of the plurality of fins.

Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant.

A device package comprising an integrated cooling assembly. The integrated cooling assembly comprising a semiconductor device and a manifold attached to the semiconductor device. The manifold comprises a top portion, a spacer extending downwardly from the top portion to a backside of the semiconductor device, and a vibrational membrane disposed between portions of the manifold. The top portion, the spacer, and the backside of the semiconductor device collectively define a coolant chamber volume therebetween.

An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed.

Systems, apparatus, articles of manufacture, and methods for temperature control of jet impingement cooling of integrated circuit packages are disclosed. An example system includes: a first nozzle to direct a first portion of impingement fluid towards an integrated circuit package; a second nozzle to direct a second portion of the impingement fluid towards the integrated circuit package; a first flow restrictor to control a first pressure of the first portion of the impingement fluid provided to the first nozzle; and a second flow restrictor to control a second pressure of the second portion of the impingement fluid provided to the second nozzle.

A cooling system for cooling a temperature-dependent power device includes an active cooling device and a controller to generate and transmit a drive signal thereto to selectively activate the device. The controller receives an input from sensors regarding the cooling device power consumption and measured operational parameters of the power equipmentincluding the power device output power if the device is a power producing device or the power device input power if the device is a power consuming device. The controller generates and transmits a drive signal to the cooling device based on the cooling device power consumption and the measured power device input or output power in order to cause the active cooling device to selectively cool the heat producing power device. A net system power output or total system power input can be maximized/minimized by controlling an amount of convection cooling provided by the cooling device.