Removing device including: a heat exchanger that is mounted on a platen so that the exchanger lies above and a distance away from an electronic component; a chassis that lies between the electronic component and the platen, and device for fastening the chassis to the platen or to the electronic board; a rigid heat sink that is mounted on the chassis in order to slide perpendicularly to the electronic board and that has a first end making contact with the component and a second end in abutment against a thermally conductive layer that is fastened to the platen in order to elastically return the rigid heat sink into abutment against the electronic component whatever the thickness of the electronic component. Electronic equipment having such a removing device.

A power semiconductor module (1) is specified, comprising: at least one semiconductor chip (5) being connected to a cooling structure (3), at least two power terminals (7) being in electrical contact to the at least one semiconductor chip (5), and a housing (23) for the power semiconductor chip (5) and the at least two power terminals (7), wherein each of the at least two power terminals (7) has a protruding part (9) protruding beyond the housing (23) in lateral directions, and each of the at least two protruding parts (9) is provided with a first alignment hole (10).

Further, a power semiconductor device and a method for producing a power semiconductor device is specified.

A cooling device dissipates heat of an object to be cooled, and has a cooling fluid line for the passage of cooling fluid, base component which has one or more cooling fluid line portions of the cooling fluid line, and heat sink for absorbing waste heat from the object to be cooled and for transmitting the waste heat to cooling fluid. The heat sink is arranged on a cooling component of the cooling device which has at least one cooling fluid line portion and which, while connecting that cooling fluid line portion to a cooling fluid line portion of the base component, is movably connected to the base component, so that the cooling component and the base component can be moved relative to one another either toward one another or away from one another if required, in order to adjust the position of the heat sink of the cooling component.

This thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part, comprises a male element comprising a protruding part relative to a base and a female element comprising an inner wall defining a housing for receiving the protruding part. The male element is configured to exert a radial force against the inner wall when the thermal conduction device is installed between the first heat source part and the second heat dissipation part so as to improve the thermal conduction between the male element and the female element.

A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.

Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers.

A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

An apparatus and system for temperature mitigation and, more particularly, a flexible heat spreader attachment that flexibly attaches to the periphery of a circuit board, allowing for its use with numerous circuit board shapes and sizes, including those of irregular shapes and sizes. The flexible heat spreader attachment includes a base plate, a heat spreader attached to the base plate, and four adjustable arms attached to the base plate, wherein each of the adjustable arms include circuit board hooks configured to attach to the periphery of a circuit board and maintain the heat spreader at a desired location on, and spaced from, the circuit board.

Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

A cooling device for dissipating heat from articles to be cooled, such as power electronic modules, having at least one preferably rigid heat sink which consists in particular of solid material, preferably composed of metal, for example composed of aluminium, and which is intended to absorb heat from one or more articles to be cooled, and having a cooling fluid chamber for accommodating cooling fluid, in particular cooling liquid, to which the heat absorbed by the heat sink can be transferred. The cooling device has at least two preferably rigid heat sinks which consist in particular of solid material and which are connected to one another in an articulated manner, in particular by way of a heat sink joint, in such a way that the two heat sinks are movable relative to one another in different, in particular parallel planes.

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.