A heat pipe is provided having a hollow body defining an interior vapor space, evaporator and condenser regions, a wick structure lining an inner wall of the hollow body, and a working fluid disposed in the hollow body, wherein a path for the working fluid in liquid state extends from the condenser region toward the evaporator region or wherein the wick structure extends along a direction from a first end of the hollow body toward the second end, and wherein the wick structure includes first and second regions that extend along the path or direction and that each have wick particles defining respective pore sizes that are different from one another.

Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

A heat pipe is provided having a hollow body defining an interior vapor space, evaporator and condenser regions, a wick structure lining an inner wall of the hollow body, and a working fluid disposed in the hollow body, wherein a path for the working fluid in liquid state extends from the condenser region toward the evaporator region or wherein the wick structure extends along a direction from a first end of the hollow body toward the second end, and wherein the wick structure includes first and second regions that extend along the path or direction and that each have wick particles defining respective pore sizes that are different from one another.

A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

A jet impingement cooling assembly for semiconductor devices includes a heat exchange base having an inlet chamber and an outlet chamber. An inlet connection may be in fluid connection with the inlet chamber, while an outlet connection may be in fluid connection with the outlet chamber. A jet plate may be coupled to the inlet chamber, and a jet pedestal may be formed on the jet plate and having a raised surface with a jet nozzle formed therein.

An impingement cooling device including a distributor plate, a manifold, and a heat spreader. The distributor plate includes a first side, a second side opposite the first side, a plurality of injection ports extending through the distributor plate from the first side to the second side, and a plurality of extraction ports extending through the distributor plate from the first side to the second side. The manifold is coupled to the distributor plate and includes a partition wall separating the plurality of injection ports and the plurality of extraction ports on the first side. The heat spreader at least partially covers an object to be cooled and includes a top surface configured to oppose the second side of the distributor plate. The heat spreader further includes a surface feature on the top surface configured to increase heat transfer therefrom.

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.

A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.