An object of the present invention is to provide a semiconductor module with high heat dissipation at a low cost. A semiconductor module according to the present invention includes: a case having a hollow portion; a base board made of an aluminum alloy having a first portion corresponding to the hollow portion of the case, and a second portion corresponding to a main body portion of the case, the base board being attached to a bottom face of the case via the second portion; a ceramic insulating substrate disposed on the first portion of the base board; a wiring pattern disposed on the ceramic insulating substrate; semiconductor elements disposed on the wiring pattern; metal wiring boards connected to the semiconductor elements; and a sealing resin that seals the hollow portion of the case.

An apparatus having first, second, and third chambers and a plurality of receiving channels is disclosed. The first chamber includes a device surface to be cooled. The second chamber has a first surface positioned opposite to the device surface to be cooled, the first surface including a plurality of jet openings adapted to spray a coolant on the device surface when the second chamber is pressured with the coolant. The third chamber is adapted to receive coolant that left the first chamber. Each of the receiving channels has a first end in the first chamber and a second end in the third chamber. Each of the receiving channels is adjacent to a corresponding one of the jet openings and is positioned to remove coolant dispersed into the first chamber by that jet opening.

A liquid cooling power flow control system and related method are described. The system has switching assemblies for power flow control, in an enclosure. A pump circulates liquid coolant through a liquid cooling block to each switching assembly. The switching assemblies are electrically isolated from the enclosure.

Embodiments are disclosed of a thermal control plate including a cooling layer and a heating layer. The cooling layer includes a thermally conductive base adapted to be thermally coupled to one or more heat-generating electronic components, cooling fins thermally coupled to the base, and a cooling cover plate coupled to the ends of the plurality of cooling fins. The thermally conductive base, the cooling cover plate, and the plurality of cooling fins form a plurality of cooling channels through which a working fluid can flow. The heating layer includes a heater, heating fins thermally coupled to the heater, and a heating cover plate coupled to the ends of the plurality of heating fins. The heater, the heating cover plate, and the heating fins form a plurality of heating channels through which the working fluid can flow. A fluid distribution can distribute the working fluid into the heating channels and cooling channels.

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

A cooling device includes: a case that includes a supply port for supplying coolant to an interior of the case and a discharge port for discharging coolant at the interior of the case to an exterior of the case; fins that each have a plate shape, that are arrayed at the interior of the case at separations along a plate thickness direction, and that have coolant flowing between adjacent fins; a maintenance portion that is formed at the fins and that maintains a separation between the adjacent fins; and a restraint portion that is formed at the fins and that restrains relative movement of the adjacent fins being maintained at the separation by the maintenance portion.

An object of the present invention is to provide a power conversion device that suppresses a bypass flow and has superior heat dissipation performance. The power conversion device according to the present invention includes a power semiconductor module 300 and a flow channel formation body 1000 on which the power semiconductor module 300 is disposed. The power semiconductor module 300 has a high thermal conductor 920 which is disposed at a position between a semiconductor chip and the flow channel formation body 1000 and a sealing material that seals a power semiconductor element and the high thermal conductor 920. The high thermal conductor 920 has a fin protruding to the flow channel formation body 1000 at the side of the flow channel formation body 1000 and a part of the sealing material surrounding the fin and a leading edge of the fin are on almost the same plane.

A piezoelectric cooling chamber and method for providing the cooling system are described. The cooling chamber includes a piezoelectric cooling element, an array of orifices and a valve. A vibrational motion of the piezoelectric cooling element causes an increase or decrease in a chamber volume as the piezoelectric cooling element is deformed. The array of orifices is distributed on at least one surface of the chamber. The orifices allow escape of fluid from within the chamber during the decrease in the chamber volume in response to the vibration of the piezoelectric element. The valve is configured to admit fluid into the chamber when the chamber volume increases and to substantially prevent fluid from exiting the chamber through the valve when the chamber volume decreases.

Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

A liquid-cooled heat sink has three parts: the water block, the X-clamp, and a copper plate. The water block has an inlet connected to a resin shell. Inside the shell, a fractal inlet manifold divides the inlet coolant flow into several sub streams that eventually exit in the form of uniformly distributed liquid jets through small nozzles/microjets at the bottom of the shell. The union between the shell and the copper plate forms a flood chamber, where the jets impinge on the copper plate, dissipating the heat supplied to the copper plate in contact with the heat source. The warm liquid is removed from the flood chamber through an outlet manifold embedded with the resin shell.