A coldplate for removing heat from one or more heat sources, such as power electronics devices, includes a baseplate including a first surface in thermally-conductive communication with the heat sources. The baseplate includes a second surface opposite the first surface to transfer heat into a cooling fluid in contact therewith. The second surface includes a peripheral flange surrounding a central region having a plurality of parallel ribs, which increase the surface area to improve heat transfer from the baseplate and into the fluid. A housing abuts the peripheral flange of the baseplate to define a cooling passage for circulation of the cooling fluid. A jet-array plate subdivides the cooling passage into a supply header and a main channel and defines a plurality of orifices to convey the fluid into the main channel and to direct the fluid toward predetermined zones on the baseplate.

Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.

An inverter (1) for operating an electrical machine (10) has at least one power semiconductor (2) and a drain contact (5) arranged on an underside of the power semiconductor (2). The drain contact (5) is arranged in a coolant channel (6) for impingement by a coolant. Also proposed are a drivetrain (20) and a motor vehicle (100).

A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

A connector system includes a cage assembly in which a thermally conductive heat sink and a connector are mounted. The heat sink includes a base, a ramp extending downwardly from the base and a pedestal extending downwardly from the base. A thermal interface material is disposed on lower surface of the pedestal. A module can be inserted into the cage assembly and connected to the connector and to the heat sink. Thermal energy generated by the module is transferred to the heat sink which dissipates the heat by convention. The ramp protects a leading edge of the thermal interface material form engagement by the module during insertion of the module into the cage assembly.

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Heat transfer devices and systems are provided for the rapid cooling of pulsed high-powered, high-flux devices using flash boiling. Such devices comprise at least two fluidly connected chambers and a heat exchanger in thermal communication with a heat source. A flash boiling event is actively triggered at a location close to the heat source by rapid depressurization of the chamber containing a multi-phase coolant. This boiling process allows for high heat transfer rates from the heat source into the chambers due to the latent heat of vaporization, which results in the rapid cooling of the heat source. A porous medium may also be positioned within a chamber of the device to enhance boiling nucleation and extended surface heat transfer. Methods of rapidly cooling pulsed heat sources are also provided using the devices and systems hereof.

A power electronics unit may include a circuit board and a cooling device. The circuit board may include at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the circuit board. The cooling device may include at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet. The cooling device may further include at least one nozzle plate having at least one flow nozzle. The at least one nozzle plate may be arranged in and divide the at least one impingement jet chamber into an inlet chamber and an outlet chamber, which may be fluidically connected to one another via the at least one flow nozzle. The at least one flow nozzle may accelerate and conduct the cooling fluid towards the heat transfer region of the at least one electronic component.