A red light-emitting micro-LED wafer includes a silicon substrate, a GaP buffer layer grown on the silicon substrate, a first doped (e.g., p-doped) GaP contact layer on the GaP buffer layer, an active region, and a second doped (e.g., n-doped) GaP contact layer on the active region. The active region includes a plurality of InGaP quantum barrier layers and one or more InGaAsP quantum well layers, where each of the one or more InGaAsP quantum well layers is sandwiched by two InGaP barrier layers of the plurality of InGaP barrier layers and is configured to emit red light. In some embodiments, the red light-emitting micro-LED wafer also includes a first doped AlGaP cladding layer between the first doped GaP contact layer and the active region, and a second doped AlGaP cladding layer between the second doped GaP contact layer and the active region.

A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.

A photon source comprising:

a quantum dot; and an optical cavity,

the optical cavity comprising: a diffractive Bragg grating “DBG”; and a planar reflection layer,

the DBG comprising a plurality of concentric reflective rings surrounding a central disk and at least one conductive track extending from the central disk across the plurality of concentric rings, the quantum dot being provided within the central disk and the planar reflection layer being provided on one side of the DBG to cause light to be preferentially emitted from the opposing side of the DBG.

A light-emitting diode chip includes a semiconductor layer sequence having a phosphide compound semiconductor material. The semiconductor layer sequence contains a p-type semiconductor region, an n-type semiconductor region, and an active layer arranged between the p-type semiconductor region and the n-type semiconductor region. The active region serves to emit electromagnetic radiation. The n-type semiconductor region faces a radiation exit area of the light-emitting diode chip, and the p-type semiconductor region faces a carrier of the light-emitting diode chip. A current spreading layer having a thickness of less than 500 nm is arranged between the carrier and the p-type semiconductor region. The current spreading layer has one or a plurality of p-doped Al.sub.xGa.sub.1-xAs layers with 0.5<x≦1.

A semiconductor device includes: a first semiconductor structure; a second semiconductor structure on the first semiconductor structure; an active region between the first semiconductor structure and the second semiconductor structure, wherein the active region includes multiple alternating well layers and barrier layers, wherein each of the barrier layers has a band gap, the active region further includes an upper surface facing the second semiconductor structure and a bottom surface opposite the upper surface; an electron blocking region between the second semiconductor structure and the active region, wherein the electron blocking region includes a band gap, and the band gap of the electron blocking region is greater than the band gap of one of the barrier layers; a first aluminum-containing layer between the electron blocking region and the active region, wherein the first aluminum-containing layer has a band gap greater than the band gap of the electron blocking region; a confinement layer between the first aluminum-containing layer and the active region, wherein the confinement layer includes a thickness smaller than the thickness of one of the barrier layers; and a p-type dopant above the bottom surface of the active region and comprising a concentration profile comprising a peak shape having a peak concentration value, wherein the peak concentration value lies in the electron blocking region.

A light-emitting diode having a stack-like structure, whereby the stack-like structure comprises a substrate layer and a mirror layer and an n-doped bottom cladding layer and an active layer, producing electromagnetic radiation, and a p-doped top cladding layer and an n-doped current spreading layer, and the aforementioned layers are arranged in the indicated sequence. The active layer comprises a quantum well structure. A tunnel diode is situated between the top cladding layer and the current spreading layer, whereby the current spreading layer is formed predominantly of an n-doped Ga-containing layer, having a Ga content >1%.

A semiconductor epitaxial structure and a method for manufacturing the same, and a light-emitting diode are provided. The semiconductor epitaxial structure includes a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer. The light-emitting layer is disposed on the first-type semiconductor layer. The second-type semiconductor layer is disposed on the light-emitting layer. The light-emitting layer includes potential well layers and potential barrier layers which are repeatedly stacked. At least part of potential barrier layers belonging to intermediate layers of the light-emitting layer is doped, and has a doping type same as the second-type semiconductor layer.

A novel thermal source comprising a semiconductor hyperbolic metamaterial provides control of the emission spectrum and the angular emission pattern. These properties arise because of epsilon-near-zero conditions in the semiconductor hyperbolic metamaterial. In particular, the thermal emission is dominated by the epsilon-near-zero effect in the doped quantum wells composing the semiconductor hyperbolic metamaterial. Furthermore, different properties are observed for s and p polarizations, following the characteristics of the strong anisotropy of hyperbolic metamaterials.

The present disclosure provides an ultraviolet LED epitaxial production method and an ultraviolet LED, where the method includes: pre-introducing a metal source and a group-V reactant on a substrate, to form a buffer layer through decomposition at a first temperature; growing an N-doped AlwGa1-wN layer on the buffer layer at a second temperature; growing a multi-section LED structure on the N-doped AlwGa1-wN layer at a third temperature, wherein a number of sections of the multi-section LED structure is in a range of 2 to 50; and each section of the LED structure comprises an AlxGa1-xN/AlyGa1-yN multi-quantum well structure and a P-doped AlmGa1-mN layer, and the multi-section LED structure emits light of one or more wavelengths, which realizes that a single ultraviolet LED emits ultraviolet light of different wavelengths, thereby improving the luminous efficiency of the ultraviolet LED.

In one embodiment, the invention relates to an optoelectronic semiconductor chip comprising a semiconductor layer sequence. The semiconductor layer sequence has an n-conducting first layer region, a p-conducting second layer region and an active zone lying therebetween for generating radiation. The second layer region comprises a first subregion directly adjacent to the active zone, the first subregion being composed of p-conducting InvAl1−vP. The second layer region also comprises a second subregion directly adjacent to the first subregion, the second subregion having p-conducting Iny(GaxAl1−x)1−yP. The second layer region also comprises a third subregion as a p-contact layer directly adjacent to the second subregion.