Methods of magnetically shielding a perpendicular STT-MRAM structure on all six sides within a flip-chip package and the resulting devices are provided. Embodiments include forming a passivation stack over an upper surface of a wafer and outer portions of an Al pad; forming a polymer layer over the passivation stack; forming a UBM layer over the Al pad, portions of the polymer layer and along sidewalls of the polymer layer; forming a T-shaped Cu pillar over the UBM layer; forming a ?-bump over the T-shaped Cu pillar; dicing the wafer into a plurality of dies; forming an epoxy layer over a bottom surface of each die; forming a magnetic shielding layer over the epoxy layer and along sidewalls of each die, the epoxy layer, the passivation stack and the polymer layer; and connecting the ?-bump to a package substrate with a BGA balls.

Methods of magnetically shielding a perpendicular STT-MRAM structure on all six sides within a flip-chip package and the resulting devices are provided. Embodiments include forming a passivation stack over an upper surface of a wafer and outer portions of an Al pad; forming a polymer layer over the passivation stack; forming a UBM layer over the Al pad, portions of the polymer layer and along sidewalls of the polymer layer; forming a T-shaped Cu pillar over the UBM layer; forming a ?-bump over the T-shaped Cu pillar; dicing the wafer into a plurality of dies; forming an epoxy layer over a bottom surface of each die; forming a magnetic shielding layer over the epoxy layer and along sidewalls of each die, the epoxy layer, the passivation stack and the polymer layer; and connecting the ?-bump to a package substrate with a BGA balls.

Methods of magnetically shielding a perpendicular STT-MRAM structure on all six sides within a flip-chip package and the resulting devices are provided. Embodiments include forming a passivation stack over an upper surface of a wafer and outer portions of an Al pad; forming a polymer layer over the passivation stack; forming a UBM layer over the Al pad, portions of the polymer layer and along sidewalls of the polymer layer; forming a T-shaped Cu pillar over the UBM layer; forming a ?-bump over the T-shaped Cu pillar; dicing the wafer into a plurality of dies; forming an epoxy layer over a bottom surface of each die; forming a magnetic shielding layer over the epoxy layer and along sidewalls of each die, the epoxy layer, the passivation stack and the polymer layer; and connecting the ?-bump to a package substrate with a BGA balls.

Methods of magnetically shielding a perpendicular STT-MRAM structure on all six sides within a flip-chip package and the resulting devices are provided. Embodiments include forming a passivation stack over an upper surface of a wafer and outer portions of an Al pad; forming a polymer layer over the passivation stack; forming a UBM layer over the Al pad, portions of the polymer layer and along sidewalls of the polymer layer; forming a T-shaped Cu pillar over the UBM layer; forming a ?-bump over the T-shaped Cu pillar; dicing the wafer into a plurality of dies; forming an epoxy layer over a bottom surface of each die; forming a magnetic shielding layer over the epoxy layer and along sidewalls of each die, the epoxy layer, the passivation stack and the polymer layer; and connecting the ?-bump to a package substrate with a BGA balls.

A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.

A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.

A semiconductor structure and methods for the creation of solder bumps configured to carry a signal and solder bumps configured for ground planes and/or mechanical connections as well as methods for increasing reliability of a chip package generally include formation of multiple sized bump bonds on under bump metallization patterns and/or pads of the same dimension. The signal carrying solder bumps are larger in terms of diameter and bump height than solder bumps configured for ground plane and/or mechanical connections.

A semiconductor structure and methods for the creation of solder bumps configured to carry a signal and solder bumps configured for ground planes and/or mechanical connections as well as methods for increasing reliability of a chip package generally include formation of multiple sized bump bonds on under bump metallization patterns and/or pads of the same dimension. The signal carrying solder bumps are larger in terms of diameter and bump height than solder bumps configured for ground plane and/or mechanical connections.

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.