Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/28
Structure, shape, material or disposition of the layer connectors prior to the connecting process
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H01L2224/28105
Layer connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. layer connectors on chip-scale packages
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H01L2224/28105

PACKAGE STRUCTURE WITH PROTECTIVE LID
20250349787 · 2025-11-13 ·

A package structure is provided. The package structure includes a chip structure and a first adhesive element partially covering the chip structure. The first adhesive element has a first portion and a second portion, and the first portion is spaced apart from the second portion. The first adhesive element has a first thermal conductivity. The package structure also includes a second adhesive element partially covering the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is higher than the first thermal conductivity.