A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

A semiconductor element including an array in which a plurality of avalanche photodiodes is arranged includes a plurality of first electrodes configured to receive supply of a first voltage to be used by the plurality of avalanche photodiodes from outside, and at least one second electrode configured to receive supply of a second voltage from outside different from the first voltage. The plurality of first electrodes and the at least one second electrode are disposed outside the array. The at least one second electrode is disposed between one and another one of the plurality of first electrodes.

A semiconductor element including an array in which a plurality of avalanche photodiodes is arranged includes a plurality of first electrodes configured to receive supply of a first voltage to be used by the plurality of avalanche photodiodes from outside, and at least one second electrode configured to receive supply of a second voltage from outside different from the first voltage. The plurality of first electrodes and the at least one second electrode are disposed outside the array. The at least one second electrode is disposed between one and another one of the plurality of first electrodes.

A bonded assembly includes a memory die containing a memory device and a plurality of bit lines, and logic die bonded to the memory die. The logic die contains a control circuit configured to control operation of the memory device. The control circuit contains a peripheral circuit region, a sense amplifier region, and a power and control signal region located adjacent to the sense amplifier region and containing at least one power and control signal interconnect structure which is configured to provide a power or control signal to or from the peripheral circuit region.

A bonded assembly includes a memory die containing a memory device and a plurality of bit lines, and logic die bonded to the memory die. The logic die contains a control circuit configured to control operation of the memory device. The control circuit contains a peripheral circuit region, a sense amplifier region, and a power and control signal region located adjacent to the sense amplifier region and containing at least one power and control signal interconnect structure which is configured to provide a power or control signal to or from the peripheral circuit region.

An apparatus is provided that includes a memory die including a pipeline circuit coupled to a memory structure. The memory die is configured to execute a first command by receiving in the pipeline circuit data to be written to the memory structure, processing the received data in the pipeline circuit and providing the processed data to the memory structure, predicting that the pipeline circuit has completed processing the received data, and ending execution of the first command based on the prediction.

An apparatus is provided that includes a memory die including a pipeline circuit coupled to a memory structure. The memory die is configured to execute a first command by receiving in the pipeline circuit data to be written to the memory structure, processing the received data in the pipeline circuit and providing the processed data to the memory structure, predicting that the pipeline circuit has completed processing the received data, and ending execution of the first command based on the prediction.

A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include an obstructive element bonded to the semiconductor element along a bond interface, the obstructive element including an obstructive material disposed over the active circuitry, the obstructive material configured to obstruct external access to the active circuitry. The bonded element can include an artifact structure indicative of a wafer-level bond in which the semiconductor element and the obstructive element formed part of respective wafers directly bonded prior to singulation.

A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include an obstructive element bonded to the semiconductor element along a bond interface, the obstructive element including an obstructive material disposed over the active circuitry, the obstructive material configured to obstruct external access to the active circuitry. The bonded element can include an artifact structure indicative of a wafer-level bond in which the semiconductor element and the obstructive element formed part of respective wafers directly bonded prior to singulation.

A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a carrier substrate. Memory stack structures vertically extend through the alternating stack. Each memory stack structure includes a respective vertical semiconductor channel and a respective memory film. A pass-through via structure vertically extends through a dielectric material portion that is adjacent to the alternating stack. The memory die can be bonded to a logic die containing peripheral circuitry for supporting operations of memory cells within the memory die. A distal end of each of the vertical semiconductor channels is physically exposed by removing the carrier substrate. A source layer is formed directly on the distal end each of the vertical semiconductor channels. A backside bonding pad or bonding wire is formed to be electrically connected to the pass-through via structure.